Title:
METHOD FOR SEPARATING SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2023/048102
Kind Code:
A1
Abstract:
The present invention relates to a method for separating a substrate, the method being characterized in that from a laminate having a substrate and a hydrophilic and water-insoluble intermediate layer on at least one surface side of the substrate, the substrate is separated by bringing the intermediate layer into contact with water.
Inventors:
FUKAYA TOMOMI (JP)
Application Number:
PCT/JP2022/034849
Publication Date:
March 30, 2023
Filing Date:
September 16, 2022
Export Citation:
Assignee:
LINTEC CORP (JP)
International Classes:
B29B17/02; B32B27/00; C08J11/06
Domestic Patent References:
| WO2020066652A1 | 2020-04-02 | |||
| WO2020059516A1 | 2020-03-26 | |||
| WO2007111385A1 | 2007-10-04 |
Foreign References:
| JP2009537686A | 2009-10-29 | |||
| JP2000509667A | 2000-08-02 | |||
| JPH07108532A | 1995-04-25 | |||
| JP2004042461A | 2004-02-12 | |||
| JP2000000874A | 2000-01-07 | |||
| JP2021160351A | 2021-10-11 |
Attorney, Agent or Firm:
OHTANI PATENT OFFICE (JP)
Download PDF: