Title:
METHOD OF SEVERING SUBSTRATE PROVIDED WITH METAL FILM
Document Type and Number:
WIPO Patent Application WO/2020/066408
Kind Code:
A1
Abstract:
Provided is a method that is capable of suitably severing a substrate provided with a metal film. This method of severing a substrate provided with a metal film includes: a dicing step of dicing a first major surface side of a substrate having a thin film layer at a specific intended severing position to expose the substrate; a scribing step of forming a scribe line by scribing the exposed substrate and extending a vertical crack from the scribe line toward the inside of the substrate along the intended severing position; a first breaking step of further extending the vertical crack by abutting a breaking bar against the substrate from a second major surface side having a metal film to sever portions of the substrate other than the metal film at the intended severing position; and a second breaking step of severing the metal film at the intended severing position by abutting the breaking bar against the substrate from the first major surface side.
Inventors:
MURAKAMI KENJI (JP)
TAKEDA MASAKAZU (JP)
TAMURA KENTA (JP)
TAKEDA MASAKAZU (JP)
TAMURA KENTA (JP)
Application Number:
PCT/JP2019/033240
Publication Date:
April 02, 2020
Filing Date:
August 26, 2019
Export Citation:
Assignee:
MITSUBOSHI DIAMOND IND CO LTD (JP)
International Classes:
H01L21/301; B26F3/00; B28D1/24; B28D5/00
Foreign References:
| JP2001176823A | 2001-06-29 | |||
| JP2002246337A | 2002-08-30 | |||
| JP2017041525A | 2017-02-23 | |||
| JPH05315646A | 1993-11-26 | |||
| JP2016225586A | 2016-12-28 | |||
| JP2007220703A | 2007-08-30 | |||
| JP2001085736A | 2001-03-30 |
Attorney, Agent or Firm:
YOSHITAKE Hidetoshi et al. (JP)
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