Title:
METHOD FOR SOLDERING CHIP ON METALLIC-CERAMIC COMPOSITE BOARD AND METALLIC-CERAMIC COMPOSITE BOARD FOR SOLDERING CHIP THEREON
Document Type and Number:
WIPO Patent Application WO/2017/032334
Kind Code:
A1
Abstract:
A method for soldering a chip on a metallic-ceramic composite board is provided, the metallic-ceramic composite board comprising a ceramic substrate, a first metal plate, and a second metal plate, plate faces at two sides of the ceramic substrate being configured to be a circuit face and a non-circuit face respectively, the first metal plate being connected to the circuit face, and the second metal plate being connected to the non-circuit face, wherein the method comprises: etching the second metal plate, such that the metallic-ceramic composite board forms a bent plate shape protruding towards the side at which the non-circuit face is located； and soldering the chip on the first metal plate, so as to obtain a substantially flat-straight metallic-ceramic composite board on which the chip is soldered. In addition, a metallic-ceramic composite board for soldering a chip thereon is provided.
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Inventors:
GONG QING (CN)
LIN XINPING (CN)
XU QIANG (CN)
ZHANG WEIFENG (CN)
SHAO CHANGJIAN (CN)
WEN HUAITONG (CN)
LIN XINPING (CN)
XU QIANG (CN)
ZHANG WEIFENG (CN)
SHAO CHANGJIAN (CN)
WEN HUAITONG (CN)
Application Number:
PCT/CN2016/096746
Publication Date:
March 02, 2017
Filing Date:
August 25, 2016
Export Citation:
Assignee:
BYD CO LTD (CN)
International Classes:
H01L23/00
Foreign References:
| CN103794571A | 2014-05-14 | |||
| CN101136396A | 2008-03-05 | |||
| CN101447439A | 2009-06-03 |
Attorney, Agent or Firm:
TSINGYIHUA INTELLECTUAL PROPERTY LLC (CN)
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