METHOD FOR SOLDERING ELECTRODE OF COLD CATHODE FLUORESCENT LAMP

WIPO Patent Application WO/2010/062072

A2

The present invention provides a method for soldering an electrode of a cold cathode fluorescent lamp, which dips an electrode lead wire with a surface on which an oxide film is formed after sealing of a glass tube of the cold cathode fluorescent lamp, into a molten solder applied with ultrasonic waves for a predetermined time to remove the oxide film from the surface of the electrode lead wire and allow the solder to be adsorbed to the surface of the electrode lead wire. Alternatively, the method for soldering an electrode of a cold cathode fluorescent lamp, dips an electrode lead wire with a surface on which an oxide film is formed after sealing of a glass tube of the cold cathode fluorescent lamp, and the fluorescent substance-free portion of the glass tube into a molten solder applied with ultrasonic waves for a predetermined time to remove the oxide film from the surface of the electrode lead wire and allow the solder to be adsorbed to the surface of the electrode lead wire. The method for soldering an electrode of a cold cathode fluorescent lamp according to the present invention, the electrode lead wire (or both the glass tube and the electrode lead wire) is soldered by using ultrasonic waves, thereby simplifying conventional complex processes, shortening working time, and improving productivity. Further, air bubbles in the solder can be removed by an ultrasonic vibration, thereby improving adhesion of the solder, and reducing defects.

SONG CHEOUL-KYU (KR)

PCT/KR2009/006710

June 03, 2010

November 27, 2009

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MECS CO LTD (KR)
SONG CHEOUL-KYU (KR)

H01J9/02; H01J9/24

KR20080019453A	2008-03-04
KR950001751B1	1995-02-28
KR19980025629A

SEHA PARTNERS (KR)
특허법인 세하 (KR)

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