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Title:
METHOD OF SOLDERING ELECTRONIC COMPONENT, AND APPARATUS OF SAME
Document Type and Number:
WIPO Patent Application WO/2010/103861
Kind Code:
A1
Abstract:
A method of soldering an electronic component, which is free of leftover solder existing between electrodes and allows a suitable amount of liquid solder to stick to the electrodes. A chip coil (1) is supported above the liquid solder surface so that the direction in which the pair of electrodes face each other is parallel to the liquid solder surface, and is swung about a first axis (X1), which is positioned below the liquid solder surface, as a center of rotation so that the left and right electrodes (3c, 3d) are alternately dipped into the liquid solder surface. Next, after horizontally holding the chip coil above the liquid solder surface and in a state in which the liquid solder is connected to the electrode through surface tension, the chip coil is rotated upward about a second axis (Y1) as a center of rotation, and liquid solder is shaken off from the electrodes. As liquid solder does not contact the region between the electrodes during dipping and pull-up, leftover solder does not appear between the electrodes.

Inventors:
HIGAKI Tadanori (Ltd. 10-1Higashikotari 1-chom, Nagaokakyo-shi Kyoto 55, 〒6178555, JP)
桧垣 忠則 (〒55 京都府長岡京市東神足1丁目10番1号株式会社村田製作所内 Kyoto, 〒6178555, JP)
OIKAWA Takashi (Ltd. 10-1Higashikotari 1-chom, Nagaokakyo-shi Kyoto 55, 〒6178555, JP)
Application Number:
JP2010/050270
Publication Date:
September 16, 2010
Filing Date:
January 13, 2010
Export Citation:
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Assignee:
MURATA MANUFACTURING CO.,LTD. (10-1, Higashikotari 1-chomeNagaokakyo-shi Kyoto, 55, 〒6178555, JP)
株式会社村田製作所 (〒55 京都府長岡京市東神足1丁目10番1号 Kyoto, 〒6178555, JP)
HIGAKI Tadanori (Ltd. 10-1Higashikotari 1-chom, Nagaokakyo-shi Kyoto 55, 〒6178555, JP)
桧垣 忠則 (〒55 京都府長岡京市東神足1丁目10番1号株式会社村田製作所内 Kyoto, 〒6178555, JP)
International Classes:
H01F41/10; B23K1/00; B23K1/08; B23K3/00
Attorney, Agent or Firm:
TSUTSUI Hidetaka (3-1-1-208 Sakuragaoka, Seika-cho Soraku-gu, Kyoto 32, 〒6190232, JP)
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