3D WIRE BLOCK

RELATED APPLICATIONS

The present application references and incorporates the entire subject matter prior application of Trace Anywhere Interconnect serial number 15/189,435 filed on June 22, 2016 by applicant as if incorporated herein.

BACKGROUND

1. Field of Invention

The present invention relates generally to the electrical test and measurement and specifically it relates to a new way of creating electrically conductive paths in a block. In particular the present invention relates to fccming an electrical interconnect mechanism between two or more discrete contact points such as but not limited to circuit pads within two or mere parallel circuit planes with circuitry formed in thiee-dimensional space between the aforementioned two or more circuit planes in order to allow for electrical coupling of two or more electrical devises through said interconnect device. This new mechanism of the present invention decreases design time and increases conductive path routing options when compared to current industry mechanisms.

2. THE RELATED ART Conventional interconnect technology limits the routing of circuitry to the χ-y plane by way of conductive traces. These traces are then connected in the z-axis through holes (vias) formed perpendicular to the traces, aligned over the traces. These vias are men coated or plated with a metallization either partially or completely filled, connecting the traces to circuitry formed in the x-y planes above and below.

It is normal for these interconnect structures to have an array of contact pads on either side of the outer major surfaces of the structure and occasionally even on the minor sides or surfaces of the structure. These contact pads are meant to be electrically coupled with electronic components on the outer surfaces. When there are a large number of contact pads or points on each side to be electrically coupled the internal circuitry layers become very dense and require a targe number of routing layers. Each of these layers are traditionally formed in layer pairs of two, sandwiched on both sides of a dielectric sheet. These sheets are manufactured concurrently then bonded together with additional dielectric sheet layers forming multilayered structures. Vias are then formed and metalized through or partially through these layer stacks making the required z axis interconnects. Partial or buried vias can be formed and metalized on each of the layer pairs prior to bonding the layers together.

Alternatively, to improve routing density dielectric layers and circuitry layers can be built up one on top of another sequentially with blind vias formed only where necessary. This eliminates the need of through vias, which take up routing space in the x-y planes on layers where the vias is not essential. This via anywhere approach greatly improved routing density but suffers from the cost of time and labor to build these layers sequentially.

SUMMARY

The present invention provides a mechanism and a structure in which an electrical interconnect mechanism is formed having complex connections between two or more discrete contact points such as but not limited to circuit pads within two or more parallel circuit planes with circuitry formed in three-dimensional space between the aforementioned two or more circuit planes , in this way the present invention provides for electrical coupling of two or more electrical devices through said interconnect device.

The present invention provides for a structure and a mechanism by which, by utilizing additive manufacturing processes electrical connections are created that connect the top and bottom of a block in a customizable pattern. Specifically connection points can be created on the surface of the block and routed to alternate locations transforming the original pattern to a smaller, larger, or alternate pattern.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a sectional side view of the additive metal construction of the present invention before dielectric fill;

FIG.2 is a sectional side view of the additive metal construction of the present invention after dielectric fill;

FIG 3 is a sectional side view of the metal and dielectric of the present invention after bottom plate is removed;

FIG 4 is a side view of an embodiment of the present invention in which unique construction options are used in accordance with the mechanism of the present invention; FIG. 5 is a sectional view of one embodiment for the present invention showing reinforcing mechanics;

FIG.6 is a -sectional view of another embodiment of the present invention;

FIG. 7 shows another embodiment for the present invention in which the structure of the present invention is connected for a test and measurement application.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

The present application references and incorporates the entire subject matter prior application of Trace Anywhere Interconnect serial number 15/189,435 filed on June 22, 2016 by applicant as if incorporated herein .The difference between the prior application in the current one is that metallization is provided first before the dielectric material such as but not limited to plastic is added in the current present application. The exact opposite is the case in the prior Trace Anywhere Interconnect application.

Referring now to the drawings of Figs 1-7, Figs. 1-3 show the basic construction steps for the structure and mechanism of the present invention. FIG. 4 shows some alternate and advantageous wiring capabilities using this mechanism. FIGS. 5 and 6 show two embodiments of the present invention. FIG. 7 shows another embodiment in which the structure of the present invention is connected for a test and measurement application. FIGS. 1-3 describe the basic construction technique in detail of the present invention.. First, metal .formed by a 3D printer or commercially available and known processes (e.g. material jetting, binder jetting, material extrusion, powder bed fusion, directed energy deposition, or sheet lamination), is deposited and formed to a desired shape through an additive process (FIG. 1) (1,23,4),. A dielectric (5), typically an epoxy material, is added to till in the gaps in the metal (FIG 2). Air can also be added to the model, by not allowing the mold to fill certain areas. Once the dielectric material is filled in, the holding frame (4) will be removed by a secondary process, e.g. grinding, etching, laser cutting, or milling. The finished block (6) now has separate isolated paths that will provide electrical connection to different spots on the block.

Additive manufacturing provides many advantageous options not normally available in printed wiring boards (PCB). The electrically conductive path will be referred to as a "wire" herein even though some example will not directly resemble a traditional wire.

The first wiring option is a simple straight wire that can be at any angle (1 A). This is a simple point to point connection. The second option is to put curves in the wire (IB) to aid in routing the wires within the block. The third option is to make multiple stair-step elevation changes (1C) in the wire to route within the block. A fourth option is to merge separate wires into joined much larger wires to reduce resistivity, modify inductance, modify capacitance, or simplify construction. A fifth option is to create coaxial transmission line structures (IE), waveguide, or other impedance controlled structures.

Additional mechanical structures for providing support can be added to the printed 3D wire block of the present invention. For example holes for a lid (10) and features for latching mechanism can be built in to the design. This reduces the number of steps in the construction process compared to traditional mechanisms.

FIG. 5 illustrates an embodiment of the present invention of a socket using this process to scale in a larger pitch pad pattern into a finer package size. By adding an interconnect material (9) (e.g. sheet of conductive elastomeric columns, spring pins, or other compliance interconnect device), an integrated circuits chip (8) can be socketed to a board or other interconnect device.

In the embodiment of Fig 6, an internal frame work (13) is shown within the plastic adding mechanical support structure. This internal frame 13 provides several benefits for the present invention. This will allow for alignment features (12) that are tied directly to the tolerance accuracy of the wires within the block. This will allow for mechanical connection features such as screw holes (11 ) or clips. This will increase the strength of the over all block, improving over the strength of the solid dielectric. This will also allow for modifying the temperature expansion properties of the block.

Fig 7 illustrates an application of the present invention of test measurement purposes. The application in FIG.7 is for a test and measurement application where a socket (15) must be placed on a Printed Wire Board (16) (PWB or PCB) to electrically connect it to automated test equipment, such as an Advantest 93k or Teradyne UltraFlex tester.

The 3D wire block (6) can transform the electrical pad pattern on the PCB (16) into a smaller pattern the matches the device under test Device Under Test (DUT) (8) pin out pattern.

In this application of FIG. 7 an elastomeric column (9) connects the 3D wire block (6) to the socket (15). The socket holds spring pins (14) which provide compliance to electrically connect the DUT (8) to the 3D wire block (6).

The 3D wire block of the present invention in this instance allows the PCB (16) to be manufactured more quickly and easily since it is at a larger via pitch when compared to the DUT (8) pitch- In addition the various embodiment structure of the Trace Anywhere Interconnect application can be and are incorporates herein with the mechanism and structure of the present invention.

While presently preferred embodiments have been described for purposes of the disclosure, numerous changes in the arrangement of mechanism steps and those skilled in the art can make apparatus parts. Such changes are encompassed within the spirit of the invention as defined by the appended claims.