Title:
METHOD, STRUCTURE, AND DEVICE FOR BINDING TWO SUBSTRATES
Document Type and Number:
WIPO Patent Application WO/2017/067031
Kind Code:
A1
Abstract:
A method, structure, and device for binding two substrates, comprising a first substrate and a second substrate. The binding method comprises: first forming, on a surface of the first substrate, a closed surrounding barrier provided with an air vent channel and a liquid injection channel; stacking, toward the surrounding barrier, the second substrate over the first substrate to form an adhesive storage space with the surrounding barrier as a frame of the adhesive storage space; and next, injecting, via the liquid injection channel, an adhesive into the adhesive storage space. The present invention forms a surrounding barrier between two substrates to form an adhesive storage space, and then charges, employing an injection method, an adhesive between the two substrates, thereby having advantages of convenient operation and a high efficiency.
Inventors:
ZHAO CHUNLING (CN)
Application Number:
PCT/CN2015/094500
Publication Date:
April 27, 2017
Filing Date:
November 13, 2015
Export Citation:
Assignee:
SUZHOU IND PARK YUSU ELECTRONICS LTD (CN)
International Classes:
C09J5/00
Foreign References:
| CN102153954A | 2011-08-17 | |||
| CN102469730A | 2012-05-23 | |||
| CN102527580A | 2012-07-04 |
Attorney, Agent or Firm:
SUZHOU XIANGYUAN PATENT AGENCY (GENERAL PARTNERSHIP) (CN)
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