Title:
METHOD FOR SUBSTRATE TREATMENT, DEVICE FOR SUBSTRATE TREATMENT, AND SUBSTRATE TREATMENT LIQUID
Document Type and Number:
WIPO Patent Application WO/2024/024243
Kind Code:
A1
Abstract:
The present invention relates to a method for substrate treatment, a device for substrate treatment, and a substate treatment liquid. In the method for substrate treatment, a substrate W including a first layer G is treated. A second liquid mixture P2 comprises an etchant and iodide ions (I-). The method for substrate treatment includes a first preparation step and an etching step. In the first preparation step, oxygen and/or ozone is added to the second liquid mixture P2. In the etching step, the second liquid mixture P2 prepared in the first preparation step is fed to the substrate W. In the etching step, the first layer G is etched.
Inventors:
HANAWA YOSUKE (JP)
HARUMOTO AKIKO (JP)
UEDA DAI (JP)
HARUMOTO AKIKO (JP)
UEDA DAI (JP)
Application Number:
PCT/JP2023/019337
Publication Date:
February 01, 2024
Filing Date:
May 24, 2023
Export Citation:
Assignee:
SCREEN HOLDINGS CO LTD (JP)
International Classes:
H01L21/306
Foreign References:
| JP2004235350A | 2004-08-19 | |||
| JPS63111186A | 1988-05-16 | |||
| JP2011086723A | 2011-04-28 | |||
| JP2003023003A | 2003-01-24 | |||
| JPH0922891A | 1997-01-21 | |||
| US20070163618A1 | 2007-07-19 |
Attorney, Agent or Firm:
SUGITANI Tsutomu (JP)
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