METHOD FOR SUPPRESSING BIOFILM IN WET PLATING PROCESS

Title:

METHOD FOR SUPPRESSING BIOFILM IN WET PLATING PROCESS

Document Type and Number:

WIPO Patent Application WO/2021/106920

Kind Code:

A1

Abstract:

A method for suppressing a biofilm, said method being characterized by irradiating ultrasonic waves having a frequency of from 20 kHz to 100 kHz within a plating tank, a recovery tank and a water washing tank, which are used for a wet plating device. The present invention addresses the problem of providing a method for suppressing the occurrence of a biofilm in a plating tank, a recovery tank and a water washing tank, said tanks being used in a wet plating process, without having adverse effects on a plating film.

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Inventors:

KAYANUMA YOSHIHIRO (JP)
YOSHII DAISUKE (JP)

Application Number:

PCT/JP2020/043777

Publication Date:

June 03, 2021

Filing Date:

November 25, 2020

Export Citation:

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Assignee:

MATSUDA SANGYO COMPANY LTD (JP)

International Classes:

C25D21/18; C25D5/20; C25D17/00

Foreign References:

JP2016501099A	2016-01-18
JP2011052309A	2011-03-17

Attorney, Agent or Firm:

OGOSHI Kazuteru et al. (JP)

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