Title:
METHOD FOR SUPPRESSING INCREASE WITH ELAPSE OF TIME OF CONTACT RESISTANCE OF ELECTRONIC PARTS, AND FIBER FOR SUPPRESSING INCREASE WITH ELAPSE OF TIME OF CONTACT RESISTANCE, AND FIBER PRODUCT USING THE FIBER
Document Type and Number:
WIPO Patent Application WO/2005/078181
Kind Code:
A1
Abstract:
A method for suppressing the increase with the elapse of time of the contact resistance of electronic parts, which comprises placing a fiber product containing fine particles of a metal and/or a metal compound being reactive with a sulfur compound and sparingly soluble in water, being dispersed therein, inside and/or outside of a device having electronic parts therein; and a fiber for suppressing the increase with the elapse of time of the contact resistance of electronic parts, characterized in that it contains fine particles of a metal and/or a metal compound being reactive with a sulfur compound and sparingly soluble in water, being dispersed therein.
Inventors:
TAKAHASHI TOMOMI (JP)
TSURUMI HIDEYUKI (JP)
TSURUMI HIDEYUKI (JP)
Application Number:
PCT/JP2005/001546
Publication Date:
August 25, 2005
Filing Date:
January 27, 2005
Export Citation:
Assignee:
JAPAN EXLAN CO LTD (JP)
TOYO BOSEKI (JP)
TAKAHASHI TOMOMI (JP)
TSURUMI HIDEYUKI (JP)
TOYO BOSEKI (JP)
TAKAHASHI TOMOMI (JP)
TSURUMI HIDEYUKI (JP)
International Classes:
H05K3/34; D06M11/00; H05K3/28; (IPC1-7): D06M11/00; H05K3/34
Foreign References:
| JP2001006690A | 2001-01-12 | |||
| JPS60119267A | 1985-06-26 |
Attorney, Agent or Firm:
Ueki, Kyuichi (1-16 Dojima 2-chome, Kita-ku, Osaka-sh, Osaka 03, JP)
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