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Title:
METHOD FOR SURFACE LAYER FORMATION, PROCESS FOR PRODUCING EROSION RESISTANT COMPONENT, AND STEAM TURBINE BLADE
Document Type and Number:
WIPO Patent Application WO/2010/134129
Kind Code:
A1
Abstract:
Disclosed is a method for surface layer formation, comprising a step of disposing a member (2) in a working fluid (3) and a step of disposing a Si electrode (1) separated from the member (2) by a predetermined space and applying a predetermined voltage onto the member (2) to occur discharging and thus to supply a Si component from the Si electrode (1) to the member side, thereby forming a Si-containing surface layer. For the Si electrode (1), a member having a specific resistance of not more than 0.005 Ωcm is selected. A value equivalent to or larger than the value obtained by adding a voltage drop in the Si electrode to an arc potential during discharging, or a larger value is set as a discharging detection level. The occurrence of discharging between the Si electrode (1) and the member (2) is detected by detecting a lowering in voltage to a value of not more than the discharging detection level. After the elapse of a preset period of time from the occurrence of discharge, the application of the voltage is stopped. After pausing for a given period of time, the voltage is again applied. The above procedure is repeated (4, 7, 8). Thus, a Si-containing surface layer is formed on the surface of the member.

Inventors:
GOTO AKIHIRO (JP)
TERAMOTO HIROYUKI (JP)
SUMI NOBUYUKI (JP)
NAKANO YOSHIKAZU (JP)
Application Number:
PCT/JP2009/002230
Publication Date:
November 25, 2010
Filing Date:
May 20, 2009
Export Citation:
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Assignee:
MITSUBISHI ELECTRIC CORP (JP)
GOTO AKIHIRO (JP)
TERAMOTO HIROYUKI (JP)
SUMI NOBUYUKI (JP)
NAKANO YOSHIKAZU (JP)
International Classes:
F01D5/28; C23C26/00; F01D25/00
Domestic Patent References:
WO2006070448A12006-07-06
Foreign References:
JPH0513765B21993-02-23
JP2006213004A2006-08-17
JP2006247761A2006-09-21
JP2006206964A2006-08-10
Attorney, Agent or Firm:
TAKAHASHI, Shogo et al. (JP)
Shogo Takahashi (JP)
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Claims: