Title:
METHOD FOR SURFACE METALLIZATION OF OSCILLATOR AND METALLIZED OSCILLATOR
Document Type and Number:
WIPO Patent Application WO/2021/115261
Kind Code:
A1
Abstract:
A method for surface metallization of an oscillator and a metallized oscillator. The method comprises: using an acid copper process to electroplate copper on a nickel layer in an electroplating zone of an oscillator body so as to form a thin copper layer in the electroplating zone (S110); etching the oscillator body to remove the nickel layer in a non-electroplating zone of the oscillator body (S120); performing copper electroplating on the thin copper layer in the electroplating zone to form a thick copper layer (S130); and performing tin electroplating on the thick copper layer in the electroplating zone to form a tin layer, and performing a tin protection treatment on the tin layer (S140).
Inventors:
LIU SHUIPING (CN)
KONG SHENGWEI (CN)
LIAO RUIKANG (CN)
ZHANG CHENZHAO (CN)
TANG DANLI (CN)
MA CHAO (CN)
KONG SHENGWEI (CN)
LIAO RUIKANG (CN)
ZHANG CHENZHAO (CN)
TANG DANLI (CN)
MA CHAO (CN)
Application Number:
PCT/CN2020/134557
Publication Date:
June 17, 2021
Filing Date:
December 08, 2020
Export Citation:
Assignee:
ZTE CORP (CN)
International Classes:
C25D5/02; C25D5/54
Foreign References:
| CN110528034A | 2019-12-03 | |||
| CN108425113A | 2018-08-21 | |||
| CN108425113A | 2018-08-21 | |||
| CN103025060A | 2013-04-03 | |||
| CN106399982A | 2017-02-15 | |||
| US4486273A | 1984-12-04 |
Other References:
See also references of EP 4071281A4
Attorney, Agent or Firm:
JIAQUAN IP LAW (CN)
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