Title:
METHOD FOR SURFACE TREATMENT OF MAGNESIUM ALLOY PLATE, AND MAGNESIUM ALLOY PLATE
Document Type and Number:
WIPO Patent Application WO/2011/105181
Kind Code:
A1
Abstract:
Disclosed is a method for surface treatment of a magnesium alloy plate, said method being able to cause blemishes and discoloration to not be prominent on the plate surface in the case where wet polishing has been performed to smooth the surface of the Mg alloy plate. Further disclosed is an Mg alloy plate produced by means of this method for surface treatment. The method for surface treatment of an Mg alloy plate is provided with a polishing step (1), a cleaning step (2), an excess-liquid-removing step (3), and a drying step (4), each step being performed in line. In the polishing step (1), the surface of a conveyed Mg alloy plate (W) is polished by a polishing belt (1A) (polishing material) while using a polishing liquid (13). In the cleaning step (2), after the polishing step (1), the polishing liquid (13) adhered to Mg alloy plate is washed away with a cleaning liquid (21). In the excess-liquid-removing step (3), the cleaning liquid (21) that adhered to the Mg alloy plate (W) in the cleaning step (2) is eliminated. In the drying step (4), the cleaning liquid (21) that was not eliminated in the excess-liquid-removing step (3) and that remains on the surface of the Mg alloy plate (W) is dried. Furthermore, in the polishing step (1), the surface roughness of the Mg alloy plate (W) is caused to be, for example, an arithmetic average roughness (Ra) that satisfies Ra ≤ 1.2 μm.
Inventors:
INOUE, Ryuichi (1-1, Koyakita 1-chome, Itami-sh, Hyogo 16, 〒6640016, JP)
井上 龍一 (〒16 兵庫県伊丹市昆陽北一丁目１番１号 住友電気工業株式会社伊丹製作所内 Hyogo, 〒6640016, JP)
NAGAYAMA, Naoki (1-1, Koyakita 1-chome, Itami-sh, Hyogo 16, 〒6640016, JP)
井上 龍一 (〒16 兵庫県伊丹市昆陽北一丁目１番１号 住友電気工業株式会社伊丹製作所内 Hyogo, 〒6640016, JP)
NAGAYAMA, Naoki (1-1, Koyakita 1-chome, Itami-sh, Hyogo 16, 〒6640016, JP)
Application Number:
JP2011/052147
Publication Date:
September 01, 2011
Filing Date:
February 02, 2011
Export Citation:
Assignee:
SUMITOMO ELECTRIC INDUSTRIES, LTD. (5-33, Kitahama 4-chome Chuo-ku, Osaka-sh, Osaka 41, 〒5410041, JP)
住友電気工業株式会社 (〒41 大阪府大阪市中央区北浜四丁目５番３３号 Osaka, 〒5410041, JP)
INOUE, Ryuichi (1-1, Koyakita 1-chome, Itami-sh, Hyogo 16, 〒6640016, JP)
井上 龍一 (〒16 兵庫県伊丹市昆陽北一丁目１番１号 住友電気工業株式会社伊丹製作所内 Hyogo, 〒6640016, JP)
住友電気工業株式会社 (〒41 大阪府大阪市中央区北浜四丁目５番３３号 Osaka, 〒5410041, JP)
INOUE, Ryuichi (1-1, Koyakita 1-chome, Itami-sh, Hyogo 16, 〒6640016, JP)
井上 龍一 (〒16 兵庫県伊丹市昆陽北一丁目１番１号 住友電気工業株式会社伊丹製作所内 Hyogo, 〒6640016, JP)
International Classes:
C23F1/00; B24B7/12; B24B21/04; C22C23/02; C23F1/22; C23G1/00; C23G3/02
Attorney, Agent or Firm:
YAMANO, Hiroshi (KEIMEI PATENT OFFICE, 10F ASTRO Shin Osaka 2 Bldg., 1-3, Nishinakajima 6-chome, Yodogawa-ku, Osaka-sh, Osaka 11, 〒5320011, JP)
Claims:
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