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Title:
METHOD FOR SYNTHESIZING COPPER-SILVER ALLOY, METHOD FOR FORMING CONDUCTION PART, COPPER-SILVER ALLOY, AND CONDUCTION PART
Document Type and Number:
WIPO Patent Application WO/2019/022039
Kind Code:
A1
Abstract:
Provided are a method for synthesizing a copper-silver alloy, whereby a copper-silver alloy can easily be synthesized at low temperature and in a short time, a method for forming a conduction part, and a copper-silver alloy and a conduction part. The present invention is provided with an ink preparation step for preparing a copper-silver ink by mixing copper salt particles, an amine-based solvent, and silver salt particles, an application step for applying the copper-silver ink to a member to be coated, a nucleation step for generating copper crystal nuclei having a crystal grain size of 0.2 µm or less and/or silver crystal nuclei having a crystal grain size of 0.2 µm or less from the copper-silver ink, and a crystal nucleus synthesis step for synthesizing the copper crystal nuclei and the silver crystal nuclei.

Inventors:
JIU Jinting (23, Senju-Hashido-cho, Adachi-k, Tokyo 55, 〒1208555, JP)
UESHIMA Minoru (23, Senju-Hashido-cho, Adachi-k, Tokyo 55, 〒1208555, JP)
SUGANUMA Katsuaki (1-1 Yamadaoka, Suita-sh, Osaka 71, 〒5650871, JP)
LI Wanli (1-1 Yamadaoka, Suita-sh, Osaka 71, 〒5650871, JP)
Application Number:
JP2018/027602
Publication Date:
January 31, 2019
Filing Date:
July 24, 2018
Export Citation:
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Assignee:
SENJU METAL INDUSTRY CO., LTD. (23 Senju-Hashido-cho, Adachi-ku Tokyo, 55, 〒1208555, JP)
OSAKA UNIVERSITY (1-1 Yamadaoka. Suita-shi, Osaka, 71, 〒5650871, JP)
International Classes:
C23C26/00; C09D11/037; C09D11/52; H01B13/00; H05K3/12; C22C5/08; C22C9/00
Domestic Patent References:
WO2014156489A12014-10-02
Foreign References:
JP2017074702A2017-04-20
JP2017041504A2017-02-23
JP2006183110A2006-07-13
Attorney, Agent or Firm:
KENMOTSU Hidetaka (302 3F, Nagata Building 6-11-3, Toyotama-kita, Nerima-k, Tokyo 12, 〒1760012, JP)
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