Title:
METHOD, SYSTEM, AND APPARATUS FOR PROCESSING WAFER
Document Type and Number:
WIPO Patent Application WO/2022/250208
Kind Code:
A1
Abstract:
An embodiment of the present invention provides a method for processing a wafer, the method comprising the steps of: preparing a wafer that has a notch portion formed on one side thereof; aligning the wafer by analyzing image information about the notch portion captured by a vision camera; and using a notch wheel to process the notch portion so that a certain region of the notch portion has a preset thickness.
Inventors:
JUNG IL JUN (KR)
KIM KI HO (KR)
HAN JUNG YUL (KR)
LEE KI HEON (KR)
PARK JI HUN (KR)
KIM KI HO (KR)
HAN JUNG YUL (KR)
LEE KI HEON (KR)
PARK JI HUN (KR)
Application Number:
PCT/KR2021/014287
Publication Date:
December 01, 2022
Filing Date:
October 14, 2021
Export Citation:
Assignee:
MEERE CO INC (KR)
International Classes:
H01L21/67; B24B9/06; B24B49/12; H01L21/304; H01L21/68
Foreign References:
| JP2014229650A | 2014-12-08 | |||
| JP2000084811A | 2000-03-28 | |||
| KR101974379B1 | 2019-09-06 | |||
| KR100760893B1 | 2007-09-27 | |||
| KR102001372B1 | 2019-07-18 | |||
| JP2001038637A | 2001-02-13 |
Attorney, Agent or Firm:
THEWAVE IP LAW FIRM (KR)
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