Title:
METHOD AND SYSTEM FOR TIN IMMERSION AND SOLDERING OF CORE WIRE
Document Type and Number:
WIPO Patent Application WO/2019/085177
Kind Code:
A1
Abstract:
Disclosed are a method and a system for tin immersion and soldering of a core wire. The method for tin immersion and soldering of a core wire comprises: vertically inserting a core wire bank (40) into molten tin (11) to melt the insulation skin on the core wires of the core wire bank (40) and performing pre-tinning for inner core conductors; in the molten tin (11), moving the core wires in one direction perpendicular to the core wire bank (40) to remove carbonized matter (50), on the moving direction side, of the core wires; pulling the core wires out of the molten tin (11); and performing alignment, such that the inner core conductors, on the moving direction side, of the core wires are respectively in contact with a bonding pad (60). In this way, the carbonized matter (50) on faces, aligned with the bonding pad (60), of the core wires is effectively removed, such that the automatic soldering temperature transfer effect is improved, the automatic soldering yield is greatly increased, and the automatic soldering consistency and yield are more stable.
Inventors:
DU GANG (CN)
Application Number:
PCT/CN2017/116176
Publication Date:
May 09, 2019
Filing Date:
December 14, 2017
Export Citation:
Assignee:
GOERTEK INC (CN)
International Classes:
B23K1/00; B23K1/08
Foreign References:
| CN104480421A | 2015-04-01 | |||
| CN103259151A | 2013-08-21 | |||
| CN105081499A | 2015-11-25 | |||
| CN102957077A | 2013-03-06 | |||
| CN101448372A | 2009-06-03 | |||
| JP2000111468A | 2000-04-21 |
Attorney, Agent or Firm:
TEKYRS INTELLECTUAL PROPERTY INC. (CN)
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