Title:
METHOD FOR THIN FILM DEPOSITION OF LAYERED STRUCTURE MATERIALS USING ATOMIZED SPRAY AND APPARATUS THEREFOR
Document Type and Number:
WIPO Patent Application WO/2020/060032
Kind Code:
A1
Abstract:
The present invention relates to a method and apparatus for thin film deposition of layered structure materials using atomized spray. The method and apparatus for thin film deposition using atomized spray according to the present invention: can uniformly deposit two-dimensional layered structure materials directly on a substrate over a large area, regardless of the type of substrate, such as an ITO, a silicon substrate, or glass, by depositing mist containing microdroplets having a size of 1 to 50 µm on the substrate at an appropriate droplet rate; and does not require a process for separation from the substrate, and thus is advantageously compatible with the existing semiconductor process. In addition, there is no need to use additives for a suspension and thus high-quality, low impurity two-dimensional crystalline thin films and heterogeneous thin films can be effectively laminated; and the required equipment can be inexpensive and thus a large industrial scale up is possible.
Inventors:
LEE SANG WUK (KR)
GENNADY PANIN (KR)
KANG TAE WON (KR)
GENNADY PANIN (KR)
KANG TAE WON (KR)
Application Number:
PCT/KR2019/010178
Publication Date:
March 26, 2020
Filing Date:
August 12, 2019
Export Citation:
Assignee:
UNIV DONGGUK IND ACAD COOP (KR)
International Classes:
B05B17/00; B05B12/00; B05B17/06; C09D1/00; H01L21/02; H01L21/324; H01L29/16
Domestic Patent References:
| WO2017154937A1 | 2017-09-14 |
Foreign References:
| KR20180080295A | 2018-07-11 | |||
| KR20160007177A | 2016-01-20 | |||
| KR20150114509A | 2015-10-12 | |||
| JPH07116575A | 1995-05-09 |
Attorney, Agent or Firm:
E-SANG PATENT & TRADEMARK LAW FIRM (KR)
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