METHOD FOR TRANSPOSING HOLOGRAM INTO MOLDED MATERIAL BY USING MICRO UNEVENNESS HOLOGRAM

WIPO Patent Application WO/2011/043525

A1

The present invention relates to a method for transposing hologram into a molded material, and more specifically, to a method for transposing hologram into a molded material by integrating an injection mold with a sheet to which micro unevenness hologram is transposed. According to the present invention, the method for transposing the hologram into the molded material by using the micro unevenness hologram comprises the steps of: a micro unevenness hologram formation step for forming the hologram with micro unevenness on a metal plate by laser; a hologram sheet transposing step for transposing the micro unevenness hologram into the sheet fabric such as PET, PC, PVC or PP or the like; a sheet insertion step for inserting the sheet to which the micro unevenness hologram is transposed into the injection mold, and sticking the sheet to the injection mold by a vacuum generator; and a hologram molded material transposing step for injecting resin into the injection mold, and transposing the micro unevenness hologram formed on the sheet into the molded material via heating and cooling processes.

JANG MYUNG SUP (KR)
HAN MI SOOK (KR)
JEONG CHANG KI (KR)
LEE HWA SUL (KR)

PCT/KR2010/002615

April 14, 2011

April 27, 2010

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JANGHAN INPLA CO LTD (KR)
SUN KYONG HOLOGRAM CO LTD (KR)
JANG MYUNG SUP (KR)
HAN MI SOOK (KR)
JEONG CHANG KI (KR)
LEE HWA SUL (KR)

B29C45/14

KR20040074201A	2004-08-23
JP2002251122A	2002-09-06
KR20070067107A	2007-06-27
JP2003009941A	2003-01-14
JPH09234999A	1997-09-09

PARK, Yang-ho et al. (KR)
박양호 (KR)

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