Title:
METHOD OF TREATING COPPER ETCHING WASTE LIQUOR
Document Type and Number:
WIPO Patent Application WO/2012/033077
Kind Code:
A1
Abstract:
[Problem] To decompose hydrogen peroxide in a copper etching waste liquor that contains hydrogen peroxide at a high concentration, with high efficiency.
[Solution] A method of treating a copper etching waste liquor containing hydrogen peroxide, which comprises adjusting the copper etching waste liquor to pH 4 or more. When a copper etching waste liquid, which is usually a strongly acidic solution having a pH value of 3 or less, is adjusted to pH 4 or more, a copper-containing SS is generated, and the generated SS acts as a catalyst for the decomposition of hydrogen peroxide. Therefore, hydrogen peroxide in the copper etching waste liquid can be decomposed with high efficiency only by adjusting the copper etching waste liquor to pH 4 or more, without the need of dilution or heating, and without the use of any chemical substance other than an alkali agent that is used for adjusting the pH value.
Inventors:
NAKAHARA TOSHITSUGU (JP)
Application Number:
PCT/JP2011/070225
Publication Date:
March 15, 2012
Filing Date:
September 06, 2011
Export Citation:
Assignee:
KURITA WATER IND LTD (JP)
NAKAHARA TOSHITSUGU (JP)
NAKAHARA TOSHITSUGU (JP)
International Classes:
C02F1/58; C02F1/62; C22B3/44; C22B15/00; C23F1/00; C23F1/18
Foreign References:
| JP2005193191A | 2005-07-21 | |||
| JP2007038196A | 2007-02-15 | |||
| JP2010077521A | 2010-04-08 | |||
| JPH04227896A | 1992-08-17 |
Attorney, Agent or Firm:
SHIGENO, Tsuyoshi (JP)
Takeshi Shigeno (JP)
Takeshi Shigeno (JP)
Download PDF:
Claims:
Previous Patent: RESIN COMPOSITION AND OBJECT MOLDED THEREFROM
Next Patent: ADDITIVE FOR MOLDING OF CERAMIC MATERIAL
Next Patent: ADDITIVE FOR MOLDING OF CERAMIC MATERIAL