Title:
METHOD FOR WINDING LEAD WIRE ON MULTILAYER COIL ELECTRONIC COMPONENTS
Document Type and Number:
WIPO Patent Application WO/2010/067515
Kind Code:
A1
Abstract:
Provided is a method for winding lead wire on multilayer coil electronic components that prevents lead wire coil sagging or breaking and terminal disconnection failures. The lead wire (9) is wound on a core (7) only a prescribed number of turns, forming a first layer (17) and a second layer (18). The lead wire (9) is folded back in the direction of an electrode (4b), is pulled in the direction of the electrode (4b) on the coil ending side to cross over the second layer (18), and is wound around an exposed portion of the core (7) between the coil ending portion of the first layer (17) and a flange (8b). The lead wire (9) is additionally hooked on the base (20) of the flange (8b), and a final terminal part (10b) is formed. The final terminal part (10b) of the lead wire (9) is then thermocompression bonded to the electrode (4b).
Inventors:
ISHIDO, Yoshimitsu (10-1, Higashikotari 1-chome, Nagaokakyo-sh, Kyoto 55, 〒6178555, JP)
石堂義光 (〒55 京都府長岡京市東神足１丁目１０番１号株式会社村田製作所内 Kyoto, 〒6178555, JP)
石堂義光 (〒55 京都府長岡京市東神足１丁目１０番１号株式会社村田製作所内 Kyoto, 〒6178555, JP)
Application Number:
JP2009/006006
Publication Date:
June 17, 2010
Filing Date:
November 11, 2009
Export Citation:
Assignee:
MURATA MANUFACTURING CO., LTD. (10-1, Higashikotari 1-chome Nagaokakyo-sh, Kyoto 55, 〒6178555, JP)
株式会社村田製作所 (〒55 京都府長岡京市東神足１丁目１０番１号 Kyoto, 〒6178555, JP)
ISHIDO, Yoshimitsu (10-1, Higashikotari 1-chome, Nagaokakyo-sh, Kyoto 55, 〒6178555, JP)
株式会社村田製作所 (〒55 京都府長岡京市東神足１丁目１０番１号 Kyoto, 〒6178555, JP)
ISHIDO, Yoshimitsu (10-1, Higashikotari 1-chome, Nagaokakyo-sh, Kyoto 55, 〒6178555, JP)
International Classes:
H01F41/04; H01F5/00; H01F27/29; H01F30/00; H01F41/06
Attorney, Agent or Firm:
YANASE, Yuji et al. (4F TAKAGI BLDG, 1-19 Nishitenma 5-chome, Kita-ku, Osaka-sh, Osaka 47, 〒5300047, JP)
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