Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
METHODS OF AND APPARATUS FOR ELECTROCHEMICALLY FABRICATING STRUCTURES
Document Type and Number:
WIPO Patent Application WO2003095710
Kind Code:
A3
Abstract:
Multi-layer structures are electrochemically fabricated by depositing a first material, selectively etching the first material (e.g. via a mask), depositing a second material to fill in the voids created by the etching, and then planarizing the depositions so as to bound the layer being created and thereafter adding additional layers to previously formed layers. The first and second depositions may be of the blanket or selective type. The repetition of the formation process for forming successive layers may be repeated with or without variations (e.g. variations in: patterns; numbers or existence of or parameters associated with depositions, etchings, and or planarization operations; the order of operations, or the materials deposited). Other embodiments form multi-layer structures using operations that interlace material deposited in association with some layers with material deposited in association with other layers.

More Like This:
JP2003515235[Title of Invention] CMOS compatible MEM switch and manufacturing method
JP2002525213INDUSTRIAL APPLICABILITY A component of a micromechanism having a closed diaphragm opening.
JP3100621Small heat dissipation / power generation structure
Inventors:
SMALLEY DENNIS R
Application Number:
PCT/US2003/014860
Publication Date:
August 18, 2005
Filing Date:
May 07, 2003
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
MEMGEN CORP (US)
International Classes:
B81B3/00; G01P15/08; G01P15/125; H01L21/288; H01L21/768; H01P1/202; H01P3/06; H01P5/18; H01P11/00; H05K3/46; (IPC1-7): C25D1/00; C25D5/02; C25D5/10
Foreign References:
US6355147B12002-03-12
US6287968B12001-09-11
US20010024872A12001-09-27
EP0567332A21993-10-27
US20010014409A12001-08-16
US5824374A1998-10-20
US20020020628A12002-02-21
Other References:
COHEN A ET AL: "EFAB: rapid, low-cost desktop micromachining of high aspect ratio true 3-D MEMS", MICRO ELECTRO MECHANICAL SYSTEMS, 1999. MEMS '99. TWELFTH IEEE INTERNATIONAL CONFERENCE ON ORLANDO, FL, USA 17-21 JAN. 1999, PISCATAWAY, NJ, USA,IEEE, US, 17 January 1999 (1999-01-17), pages 244 - 251, XP010321754, ISBN: 0-7803-5194-0
Download PDF:
View/Download PDF      PDF Help



 
Previous Patent: MULTISTEP RELEASE METHOD FOR ELECTROCHEMICALLY FABRICATED STRUCTURES

Next Patent: ELECTROCHEMICALLY FABRICATED STRUCTURES HAVING DIELECTRIC OR ACTIVE BASES