Title:
METHODS AND APPARATUS FOR JOINING SMALL DIAMETER CONDUCTORS WITHIN MEDICAL ELECTRICAL LEADS
Document Type and Number:
WIPO Patent Application WO2004028619
Kind Code:
B1
Abstract:
A conductor assembly and methods for mechanically and electrically coupling a small diameter conductor to a lead component having a relatively larger sized conductor bore is provided. The assembly includes a sizing member sized to fit securely around a relatively small diameter conductor and to further fit within a conductor bore so that temporary compression (e.g., crimping, crushing, or staking) of a discrete portion of the conductor bore mechanically couples, and establishes electrical communication between, the conductor and the lead component. Alternately, a conductive sleeve member having a relatively large diameter conductor bore is adapted to receive a sizing unit to downsize one side of the sleeve member in a manner similar to the foregoing. In this case, a relatively smaller diameter one of a pair of different diameter elongated conductors is firmly mechanically coupled and in electrical communication with a relatively larger diameter conductor.
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Inventors:
BELDEN ELISABETH L
Application Number:
PCT/US2003/030049
Publication Date:
August 26, 2004
Filing Date:
September 25, 2003
Export Citation:
Assignee:
MEDTRONIC INC (US)
International Classes:
A61N1/05; H01R13/187; H01R4/20; H01R11/07; H01R13/58; H01R31/06; (IPC1-7): A61N1/05; H01R4/20; H01R31/06
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