Title:
METHODS AND APPARATUS FOR SUPPORTING WAN AND D2D COMMUNICATION RLC LAYER HANDOVER
Document Type and Number:
WIPO Patent Application WO/2013/177185
Kind Code:
A3
Abstract:
A method, an apparatus, and a computer program product for supporting RLC layer handover between WAN supported D2D communications and direct D2D communications. In one example, a first UE may be operable to transmit a WAN handover request including a peer identifier and a cell identifier associated with a second UE to an eNB, where the first UE and the second UE are engaged in direct D2D communications. The eNB may be equipped to communicate the WAN handover request to a second eNB associated with the second UE and receive a RLC parameter indicating a last successful reception by the second UE. The eNB may transmit the RLC parameter to the first UE. The first UE may be equipped to determine a subsequent content item based on the received RLC parameter and may transmit the subsequent content item to the second UE via the eNB.
Inventors:
MADAN RITESH K (US)
LI JUNYI (US)
LI JUNYI (US)
Application Number:
PCT/US2013/042055
Publication Date:
January 09, 2014
Filing Date:
May 21, 2013
Export Citation:
Assignee:
QUALCOMM INC (US)
International Classes:
H04W36/00; H04W36/16; H04W76/02
Domestic Patent References:
| WO2012048464A1 | 2012-04-19 | |||
| WO2010102668A1 | 2010-09-16 | |||
| WO2001062026A1 | 2001-08-23 |
Attorney, Agent or Firm:
O'HARE, James K. (5775 Morehouse DriveSan Diego, Califonia, US)
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