METHODS AND APPARATUS FOR THERMAL BASED SUBSTRATE PROCESSING WITH VARIABLE TEMPERATURE CAPABILITY

WIPO Patent Application WO/2012/003177

A3

A substrate support may include a body; an inner ring disposed about the body; an outer ring disposed about the inner ring forming a first opening therebetween; a first seal ring disposed above the first opening; a shadow ring disposed above the inner ring, extending inward from the outer ring and forming a second opening between the shadow and outer rings; a second seal ring disposed above the second opening; a space at least partially defined by the body and the inner, outer, first, second, and shadow rings; a first gap defined between a processing surface of a substrate when present and the shadow ring; and a plurality of second gaps fluidly coupled to the space; wherein the first gap and the plurality of second gaps are configured such that, when a substrate is present, a gas provided to the space flows out of the space through the first gap.

TZU GWO-CHUAN (US)
YUAN XIAOXIONG (US)
KHANDELWAL AMIT (US)
WANG BENJAMIN CHENG (US)
GELATOS AVGERINOS V (US)
WU KAI (US)
KARAZIM MICHAEL P (US)
LIN JING (US)
CUVALCI OLKAN (US)

PCT/US2011/042125

March 29, 2012

June 28, 2011

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APPLIED MATERIALS INC (US)
TZU GWO-CHUAN (US)
YUAN XIAOXIONG (US)
KHANDELWAL AMIT (US)
WANG BENJAMIN CHENG (US)
GELATOS AVGERINOS V (US)
WU KAI (US)
KARAZIM MICHAEL P (US)
LIN JING (US)
CUVALCI OLKAN (US)

H01L21/205

JP2002164323A	2002-06-07
US20080210379A1	2008-09-04
US20070169891A1	2007-07-26
US20030062128A1	2003-04-03

TABOADA, Alan (1030 Broad StreetSuite 20, Shrewsbury New Jersey, US)

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