METHODS OF FORMING WIRE BONDS FOR WIRE LOOPS AND CONDUCTIVE BUMPS

WIPO Patent Application WO/2011/037869

A3

A method of forming a wire bond using a bonding tool supported by a transducer of a wire bonding machine is provided. The method includes the steps of: (1) lowering a free air ball positioned at a tip of the bonding tool toward a bonding location such that the free air ball contacts the bonding location; (2) applying electrical energy to the transducer to provide a scrubbing motion of the tip of the bonding tool during and prior to the contact of the free air ball to the bonding location; and (3) removing the application of the electrical energy immediately upon the free air ball being deformed to form the wire bond

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QIN IVY WEI (US)
HUYNH CUONG (US)

PCT/US2010/049539

July 07, 2011

September 20, 2010

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KULICKE & SOFFA IND INC (US)
QIN IVY WEI (US)
HUYNH CUONG (US)

H01L21/60

JP2009059878A	2009-03-19
JPH1012652A	1998-01-16
JP2006237075A	2006-09-07
US20090020586A1	2009-01-22

SPLETZER, Christopher, M., Sr. (Inc.1005 Virginia Driv, Fort Washington PA, US)

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