SAMPLES IN A WELL PLATE

TECHNICAL FIELD AND BACKGROUND

The present disclosure relates to methods and instruments for measuring samples in a well plate. The disclosure also relates to an adapted well plate.

A well plate is commonly used in the analysis of a hquid samples, e.g. measurement of analyte concentrations or other properties for an array of different samples. The well plate (also referred to as microplate, micro wells, microtiter, multiwell plate) is a flat plate that looks like a tray with multiple wells that are used as small test tubes for the liquid samples. Well plates are commonly manufactured in a 2:3 rectangular mix with 96, 384, or 1536 wells. Recent advances in photonic circuitry may allow the measurement of various properties in a hquid sample, e.g. serum, blood, et cetera. However, the measurement of samples in a well plate by means of an optical chip is hindered by difficulty in obtaining an optical coupling with the chip. An optical fiber can be attached to the chip, but this is difficult and makes the chip too expensive to be disposable. And free-space coupling without connected fibers is difficult because the chip is typically covered in fluid of unknown optical properties or even opaque.

It is thus desired to provide a more versatile solution for measuring hquid samples in a well plate.

SUMMARY

One aspect of the present disclosure provides a method of measuring a liquid sample in a well plate by means of an optical chip.

Further aspects may relate to a well plate with optical chips or an

instrument with optical chip for measuring samples in a well plate. The optical chip comprises an optical sensor that is accessible to the hquid sample at a sampling area of the chip. The chip also comprises at least one free-space optical coupler that is accessible to receive input light and/or emit output light via a coupling area of the chip. The optical chip is configured to modify the output light with respect to the input light as a function of a property to be measured of the liquid sample proximate to the sampling area. The sampling area of the chip is submerged in the liquid sample while the liquid sample is kept away from the coupling area. This allows interrogating the optical coupler via an optical path that does not pass through the liquid sample. Accordingly, the chip can be readout via an inexpensive free-space coupling without the sample interfering with the free-space optical connection.

By keeping the coupling area of the chip in contact with a surface of the well, the coupling can be shielded from the hquid sample. By using a transparent well material at the interrogation wavelength, the optical path may extend from an external interrogator unit, through the well surface, directly to the contacting coupling area. For example, the chip may be glued to a bottom of the well for easy read out from the bottom of the well plate. The coupling area can also be shielded from the sample by a liquid tight barrier, e.g. sleeve around the chip to keep the couplers accessible to free- space optical interrogation even if the chip is submerged below the liquid level. For example, the chip with sleeve may be part of an optical

instrument that is dipped into the sample. By carefully position control, it is also possible to keep the coupling part of chip above the liquid level while only submerging the sampling area.

BRIEF DESCRIPTION OF DRAWINGS

These and other features, aspects, and advantages of the apparatus, systems and methods of the present disclosure will become better understood from the following description, appended claims, and accompanying drawing wherein: FIG 1A illustrates a perspective view of an embodiment of a well plate;

FIG IB illustrates a perspective view of an embodiment for measuring a liquid sample in a well by means of a chip contacting a well surface;

FIG 2 illustrates a perspective view of an embodiment for measuring a liquid sample in a well by means of a chip integrated with a liquid tight sleeve;

FIG 3A illustrates a cross-section view of an embodiment of a liquid tight sleeve with optical chip;

FIG 3B illustrates a cross-section view of an embodiment for a probe head inserted in the liquid tight sleeve for readout of the chip;

FIG 3C illustrates a perspective view of an embodiment of a probe head with liquid tight sleeve and optical chip;

FIG 4 illustrates a cross-section view of an embodiment for measuring a liquid sample in a well by means of a chip that is partially kept above the liquid level;

FIG 5A illustrates an overview of example components in an optical measurement system;

FIG 5B illustrates a relatively large light spot projected over a free space input coupler;

FIG 5C illustrates a relatively small light spot projected over a free space input coupler;

FIG 6A illustrates a perspective view of an embodiment of an optical chip;

FIG 6B illustrates an example for relative sizes of the optical chip with respect to the well;

FIG 7A illustrates an embodiment for readout of a well plate with chips from the bottom; FIG 7B illustrates an embodiment for readout of a well plate by an instrument dipping chips in the wells;

FIGs 8A-8C illustrate an embodiment for constructing a well plate with chips;

FIG 9A illustrates a picture of an embodiment optical sensor as ring resonator;

FIG 9B illustrates coating on the ring resonator for detecting an analyte;

FIG 9C illustrates a graph with wavelength shift of spectral features as function of analyte concentration;

FIG 9D illustrates the wavelength shift as function of time.

DESCRIPTION OF EMBODIMENTS

In some instances, detailed descriptions of well-known devices and methods may be omitted so as not to obscure the description of the present systems and methods. Terminology used for describing particular embodiments is not intended to be limiting of the invention. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. The term "and/or" includes any and all combinations of one or more of the associated listed items. It will be understood that the terms "comprises" and/or

"comprising" specify the presence of stated features but do not preclude the presence or addition of one or more other features. It will be further understood that when a particular step of a method is referred to as subsequent to another step, it can directly follow said other step or one or more intermediate steps may be carried out before carrying out the particular step, unless specified otherwise. Likewise it will be understood that when a connection between structures or components is described, this connection may be estabhshed directly or through intermediate structures or components unless specified otherwise. The invention is described more fully hereinafter with reference to the accompanying drawings, in which embodiments of the invention are shown. In the drawings, the absolute and relative sizes of systems, components, layers, and regions may be exaggerated for clarity.

Embodiments may be described with reference to schematic and/or cross- section illustrations of possibly idealized embodiments and intermediate structures of the invention. In the description and drawings, hke numbers refer to like elements throughout. Relative terms as well as derivatives thereof should be construed to refer to the orientation as then described or as shown in the drawing under discussion. These relative terms are for convenience of description and do not require that the system be constructed or operated in a particular orientation unless stated otherwise.

FIG 1A illustrates a perspective view of an embodiment of a well plate 50. FIG IB illustrates a perspective view of an embodiment for measuring a liquid sample S 1 in one of the wells 51 by means of an optical chip 10.

In one embodiment, the optical chip 10 comprises an optical sensor 13 that is accessible to the hquid sample Si at a sampling area SA of the chip. In another or further embodiment, the optical chip 10 comprises one or more free-space optical couplers 11,12 that are accessible to receive input light LI and/or emit output light L2 via a coupling area CA of the chip. Typically, the optical chip 10 is configured to modify the output light L2 with respect to the input light LI as a function of a property to be measured of the liquid sample Si proximate to the sampling area SA.

One method of measuring a liquid sample Si in a well plate 50 comprises submerging the sampling area SA in the hquid sample S 1 while keeping the liquid sample Si away from the coupling area CA. This allows interrogating the optical coupler 11, 12 via an optical path P that does not pass through the liquid sample Si. In the embodiment shown, the coupling area CA of the optical chip 10 is in contact with a well surface 51a of a well 51 in the well plate 50. The well surface 51a shields the coupling area CA from the liquid sample Si and is transparent to the input and output light L1,L2. Accordingly, the optical path P extends from the coupling area CA through the transparent well surface 51a. For example, the well plate 50 is made of polystyrene, polycarbonate or PMMA which may be transparent at typical wavelengths of e.g. 850 nm, 1550 nm, et cetera.

In the embodiment shown, the optical chip 10 is in contact with a bottom surface 51a of the well 51. While other surfaces may be used, the bottom may be advantageous because it is typically a flat surface which is relatively easy to access for an external instrument. In one embodiment, the bottom surface of the wells 51 in the well plate 50 is an optical surface, e.g. flat and/or polished, optionally with an anti-reflection coating for the light L1,L2 used for interrogating the optical coupler 11, 12. Preferably, the optical chip 10 is attached to the surface 51a of the well 51. For example, the chip 10 is attached or bonded to the surface 51 by an adhesive, e.g. glue. The chip 10 may also be partly integrated into a surface of the well 51.

Typically , the optical sensor 13 is arranged on a face of the optical chip 10 directed towards the liquid sample Si. In one embodiment, the optical coupler 11, 12 is arranged on a face of the optical chip 10 directed towards the surface 51a of the well 51. In one embodiment, the optical sensor 13 and the optical coupler 11, 12 are arranged on opposite faces of the optical chip 10. In another or further embodiment, the optical coupler 11, 12 is arranged on a side of the optical chip 10 perpendicular to a face of the optical chip 10 comprising the optical sensor 13. In some embodiments, the optical chip 10 is transparent to the input and/or output light for optically interrogating the optical coupler 11, 12 through the chip 10, e.g. a silicon based chip that is interrogated by infrared light. In such embodiments, the optical coupler 11, 12 may face away from the surface 51a of the well 51. For example, the optical sensor 13 and the optical coupler 11,12 are arranged on the same face of the optical chip 10 which may be easier to manufacture.

In one embodiment, the optical chip 10 comprises a free-space input coupler 11 configured to receive input light LI for the optical sensor 13 into the chip. In another or further embodiment, the optical chip 10 comprises a free-space output coupler 12 configured to emit output light L2 from the optical sensor 13 out of the chip. In some embodiments, an optical coupler is used for both receiving input light LI and emitting output light L2. In other or further embodiments, the optical chip 10 comprises multiple input and/or output couplers 11, 12 to read out a plurality of optical sensors on the chip.

In one embodiment, the input light LI is imaged from a remote hght source as a light spot onto a part of the coupling area CA associated with the input coupler 11. In particular, the input light spot is imaged through free space. Typically, the input light spot is imaged by projection optics 25, e.g. one or more lenses 25 and/or curved mirrors (not shown). In the embodiment shown, the input light LI is provided by a light guide 21, e.g. optical fiber. In one embodiment, the light guide has an optical exit surface, e.g. end of the optical fiber, arranged in an object plane of the projection optics 25 for imaging the exit surface onto the input coupler 11.

In one embodiment, the output light L2 from a part of the coupling area CA associated with the output coupler 12 is imaged onto a light guide 22, e.g. using the same or separated projection optics 25. In some embodiments, a first light guide 21 for delivering the input hght LI has a smaller diameter than a second light guide 22 for receiving the output light L2, e.g. smaller by a factor of at least two, four, or eight. For example, the first light guide 21 is a single mode (SM) fiber and the second light guide 22 is a multimocle (MM) fiber.

Typically, the well plate 50 comprises a plurality of wells 51, e.g. at least ten, twenty, forty, or more. To keep the well plate 50 compact, the wells 51 may be arranged in a matrix. For example, well plates are commonly manufactured in a two by three rectangular configuration with 96, 384, or 1536 wells. Also other numbers and configurations are possible. FIG 2 illustrates a perspective view of an embodiment for measuring a liquid sample Si in a well 51 by means of an optical chip 10 integrated with a liquid tight sleeve 32.

In one embodiment, the optical chip 10 is held by a hquid tight sleeve 32 configured to shield the coupling area CA from the liquid sample Si while keeping the sampling area SA exposed. Accordingly, the optical path P may extend from the coupling area CA through an interior free space inside the sleeve 32. In this way the sleeve 32 keeps the optical coupler 11, 12 free of the hquid sample Si and allows interrogating the optical coupler 11, 12 via the interior free space 26a even when the optical coupler 11, 12 is held below a liquid level H of the hquid sample Si without the output light L2 propagating through the liquid sample Si.

In one embodiment, the optical chip 10 is interrogated via an optical instrument 30 comprising a projection system 25 inside a probe head 31 that is at least partly inserted into the liquid tight sleeve 32 to establish an optical path P between the optical instrument 30 and the optical chip 10. Preferably, the optical path P comprises a free space path inside the optical instrument 30 between light guides 21,22 and the couphng area CA of the optical chip 10. Each of the input light guide 21 and or output light guide 22 may comprise one or more optical fibers, e.g. one input light guide and a plurality of output light guides..

FIG 3A illustrates a cross-section view of an embodiment of a liquid tight sleeve 32 with optical chip 10. In the embodiment shown, the optical chip 10 is integrally connected to the sleeve 32 to form a liquid tight interior space 32i. Preferably, one or more optical couplers 11, 12a, 12b, 12c of the optical chip 10 are arranged towards an inside of the sleeve 32 facing the interior space 32i. In the embodiment shown, the couplers are arranged at a hole through the sleeve 32. Alternatively, at least a bottom of the sleeve comprises transparent material, wherein the couplers are arranged to couple the light through the transparent material. Furthermore, one or more optical sensors 13a, 13b, 13c of the optical chip 10 are arranged at an outside of the sleeve 32.

FIG 3B illustrates a cross-section view of an embodiment for a probe head 31 inserted in the liquid tight sleeve 32 for readout of the optical chip 10. In the embodiment shown, the probe head 31 comprises a

protrusion that tightly fits inside the inner diameter of the sleeve 32.

Preferably, the protrusion forms a connection with a bottom of the sleeve 32. In one embodiment, a connection between the probe head 31 of the optical instrument 30 and the sleeve 32 establishes an optical path P between light guides 21,22 inside the optical instrument 30 and the coupling area CA of the optical chip 10.

FIG 3C illustrates a perspective view of an embodiment of a probe head 31 with liquid tight sleeve 32 and optical chip 10. In one embodiment, a connection between the probe head 31 and the sleeve 32 determines a relative rotation of the optics 21,22, 25a, 25b inside the optical instrument 30 with respect to the optical chip 10. For example, the probe head 31 and the sleeve 32 comprise cooperating parts 31a,32a that determine a relative orientation there between to establish the optical path between the light guides 21,22 and the optical couplers 11, 12 via the projection optics 25a,25b. In a preferred embodiment, the connection between the probe head 31 and the sleeve 32 comprises an isostatic mount. In the embodiment shown, the mound has three indentations that fit on three extensions on the read-out optics, located in a plane perpendicular to the optical axis and hundred- twenty degree separated. This has the advantage that the thermal centre is located on the optical axis, such that the chip remains aligned with the read-out optics at any temperature.

In some embodiments, the sleeve 32 is held by the optical instrument 30 using a suction mechanism sucking air from the probe head 31 to suck the sleeve 32 there against. Also other mechanisms can be envisaged for holding the sleeve, e.g. magnetic, mechanical, clamping, etc. Typically, the probe head 31 comprises one or more lenses 25a, 25b between the light guides 21,22 and the optical chip 10. In the embodiment shown, the lenses 25a,25b comprise holes 25h to allow air suction through the probe head 31.

FIG 4 illustrates a cross-section view of an embodiment for measuring a liquid sample Si in a well 51 by means of an optical chip 10 that is partially kept above the liquid fluid level H.

In the embodiment shown, the optical chip 10 is held partially above a fluid level H of the liquid sample Si with the sampling area SA of the optical chip 10 below the fluid level H to expose it to the liquid sample Si. Furthermore, the coupling area CA is held above the fluid level H to keep it free of the liquid sample SI. Accordingly, the optical path P extends through free space from the coupling area CA above the fluid level H. In one embodiment, the optical sensor 13 is used for sensing the fluid level H while the optical chip 10 is lowered by an actuator along a direction Z into the liquid sample Si. For example, an optical instrument 30 holding the optical chip 10 is lowered into the liquid sample Si to dip the sampling area SA below the fluid level H while keeping the coupling area CA above the fluid level H. Preferably, the optical instrument 30 comprises a reusable part 33, e.g. with optics 25 et cetera. The reusable part 33 may couple to a disposable part 34 connected to the chip 10. For example, the disposable part 34 comprises a plate glued to the chip wherein the plate is sucked against the reusable part 33 to form an optical coupling. In one embodiment, a first light guide 21 is connected to a light source 23, e.g. comprising a laser. In another or further embodiment, a second light guide 22 is connected to a detector 24, e.g. comprising a spectrometer. Multiple light guides may be connected to the light source and/or detectors. In some embodiments, light guides for input light LI and output light L2 may be (partly) combined.

FIG 5A illustrates an overview of example components in an optical measurement system. One embodiment of the system comprises a probe head 31 with projection optics 25 for providing input light LI onto the optical chip 10 and receive output light L2 from the optical chip 10. In some embodiments, the probe head 31 is positioned by an actuator 35. For example the actuator may position a probe head with respect to the chip in dimensions x,y,z. Also other movements can be used, e.g. rotations Rx,Ry,Rz (not shown). Also combinations may provide benefit, e.g. x,y,Rz (rotation around z-axis).

Typically, the system comprises a laser 23 or other light source. For example, the laser comprises a laser diode LD and a laser driver DRIV configured to provide electrical current ILAS to the laser. In some

embodiments, the system comprises analog front-end electronics 41 and/or digital back-end electronics 42. For example, the analog front-end

electronics 41 comprise digital to analog converters DAC and/or analog to digital converters ADC. In the embodiment shown, light from the laser diode LD is partly coupled to a photo diode PD which provides a reference current IREF, and/or any other reference signal such as wavelength. Light signal L2 captured by the optical fiber 22 may be measured using anther photo diode PD which provides a signal current ISTG. The currents may be converted to voltages by respective trans impedance amplifiers TIA, which voltages may be digitized using ADCs for processing by the digital back-end electronics 42. In the embodiment shown, the digital electronics 42 also controls the actuator 35 which moves the probe head 31 with respect to the optical chip 10.

In one embodiment, the probe head 31 is moved in dependence of a signal detection from the optical chip 10. In some embodiments, the system comprises a computer readable storage medium with program instructions that when read by the system cause the system to perform operational acts in accordance with the present disclosure. For example the system may position an optical instrument with respect to an optical chip 10 or position the optical chip 10 with respect to the liquid sample. For example, the system may estabhsh an optical coupling with the chip. For example, the system may optically interrogate the chip. In one embodiment, a monochromatic wavelength of the laser is varied over a wavelength range to and the response is measured to determine a spectrum of the optical sensor 13.

FIG 5B illustrates a relatively large light spot LI projected over a free space input coupler 11. FIG 5C illustrates a relatively small light spot LI projected over a free space input coupler 11. In the embodiment shown, the optical coupler 11 comprises a grating coupler, e.g. vertical grating coupler. Also other couplers are possible, e.g. edge couplers such as shown in the embodiment of FIG 6A.

Preferably, the optical coupler 11, 12 is configured to operate as a free space coupler without direct physical contact of external light guides such as optical fibers to the coupling area. Depending on the embodiment, the coupling area may be exposed to free space or in contact with the well surface. It will be noted that the well surface 51a is not considered a light guide in this regard, but simply a medium for propagating the light because it has no specific function of directional guidance. For example, the well surface need not be aligned with the optical coupler 11, 12 as would be the case for an external fiber. In one embodiment, the optical coupler 11, 12 has a diameter for receiving and/or emitting hght. Typically, the diameter is less than hundred micrometer, less than fifty micrometers, or even less than twenty

micrometers, e.g. between five and fifteen micrometers. In some

embodiments, an input coupler 11 is exposed to a hght spot of input light LI, wherein the light spot completely covers an area of the input coupler 11. In one embodiment, a diameter Dl of the input light spot is at least hundred micrometers, preferably at least two hundred micrometers. Increasing the hght spot diameter can make ahgnment easier but at the cost of lower light intensity. Preferably, a diameter Dl of the input light spot is thus larger than a diameter of the input coupler 11 e.g. by at least a factor two, three, five, ten, twenty, or even forty, e.g. a factor between two and hundred, preferably between ten and fifty. FIG 6 A illustrates a perspective view of an embodiment of an optical chip 10. The optical chip 10 has a plurality of optical sensors 13 on at a sampling area SA at top surface and a plurality of optical couplers 11, 12 at a front surface near the top. Of course the chip can also have other dimensions than shown.

FIG 6B illustrates an example for relative sizes of the optical chip

10 with respect to the well 51. Preferably, the optical chip 10 is dimensioned to fit inside a well 51 of the well plate 50. In one embodiment, the optical chip has dimensions Al,A2,A3 that are smaller than a diameter Bl of the well 51 by a factor of at least one-and-half, at least two, or at least three. For example, the well plate 50 comprises wells 51 with a diameter Bl of less than ten milhmeters, less than seven milhmeters, or even less than five milhmeters, e.g. between two and ten millimeters. For example, the wells 51 have a depth less than twenty millimeters, less than fifteen millimeters, less than ten milhmeters, or even less than five millimeters, e.g. between two and fifteen millimeters. For example, a largest dimension Al of the optical chip 10 is less than five millimeter, less than four millimeter, or even less than three millimeter, e.g. between one and two millimeter.

FIG 7A illustrates an embodiment for readout of a well plate 50 with chips 10 from a bottom surface of the wells 51. Some aspects of the present disclosure relate to a well plate 50 for measuring a hquid sample SI. The well plate 50 comprises a plurality of wells 51, wherein one or more wells comprise a respective optical chip 10 as described herein. The optical chip 10 is arranged to be submerged with the sampling area in the liquid sample Si while the liquid sample Si is kept away from the coupling area for interrogating the optical coupler via an optical path that does not pass through the liquid sample Si.

In one embodiment, the optical chips 10 are interrogated by an optical instrument 30 from a bottom of the well plate 50. For example, the optical instrument 30 is moved along a trajectory M with respect to the well plate 50, to read out different optical chips 10. In some embodiments, the optical instrument 30 comprises a plurality of channels for simultaneous readout of multiple chips 10. For example, each channel comprises

respective optical fibers to deliver and receive the input light LI and output light L2. The channels may comprise shared or dedicated projection optics, e.g. a lens array. In the embodiment shown, the channels are disposed in a row configuration. Also other configurations are possible. Preferably, the number of channels equals the number of wells 51 in a row of the well plate 50. In one embodiment, the optical instrument 30 is moved along a

trajectory M transverse to the rows of the well plate, wherein the optical instrument 30 simultaneously reads out a row of chips in respective wells 51.

FIG 7B illustrates an embodiment for readout of a well plate by another instrument 30 dipping chips 10 in the wells 51 for measurement. Some aspects of the present disclosure relate to an optical instrument 30 for measuring a liquid sample Si in a well plate 50, wherein the optical instrument 30 comprises or couples to one or more optical chips 10 as described herein. The optical chip 10 is arranged to be submerged with the sampling area in the liquid sample Si while the liquid sample Si is kept away from the coupling area for interrogating the optical coupler via an optical path that does not pass through the liquid sample SI.

In one embodiment, a plurality of optical chips 10 is held by an optical instrument 30 and simultaneously or sequentially dipped in respective wells 51 of the well plate 50. Preferably, the optical instrument 30 is configured to pick up new (disposable) optical chips 10 for each next measurement of a plurality of wells. Alternatively, the same optical chips are reused, e.g. the optical chips are cleaned between measurements. FIGs 8A-8C illustrate an embodiment for constructing a well plate with chips. In one embodiment, a well plate 50 is manufactured by placing a plurality of optical chips 10 onto a transparent bottom part 50a and placing a top part 50b onto the bottom part 50a. Preferably, the top part 50b has a plurality of openings there through fitting over the optical chips 10 to form a plurality of wells 51 with respective optical chips 10 at the bottom. For example, the openings are arranged in a matrix. Preferably, the top part 50b is formed by a monolithic block with openings.

FIG 9A illustrates a picture of an embodiment optical sensor as ring resonator. FIG 9B illustrates coating on the ring resonator for detecting an analyte. FIG 9C illustrates a graph with wavelength shift Δλ of spectral features as function of analyte concentration. FIG 9D illustrates the wavelength shift Δλ as function of time "t". In one embodiment, the optical sensor 13 comprises a ring resonator. In another or further embodiment, the optical sensor 13 comprises a Mach-Zehnder interferometer (not shown), which can additionally be used to measure wavelength. Also other optical sensors may be used. For example, the liquid sample Si comprises an analyte C 1 that is detected by binding to a receptor Cs on a surface of the optical sensor 13. The binding may affect the optical properties of the sensor, e.g. refractive index of the ring resonator which in turn can be detected as a shift in the spectrum of light coupling with the resonator via adjacent hght guides. Various properties of the sample may be measured, e.g. temperature, pressure, acidity, oxygen, biomarkers, et cetera. For the purpose of clarity and a concise description, features are described herein as part of the same or separate embodiments, however, it will be appreciated that the scope of the invention may include

embodiments having combinations of all or some of the features described. For example, while embodiments were shown for optical chips in being connected to a well plate or held by an instrument, also alternative ways may be envisaged by those skilled in the art having the benefit of the present disclosure for achieving a similar function and result. E.g. optical systems may be combined or split up into one or more alternative

components.

The various elements of the embodiments as discussed and shown offer certain advantages, such as mass measurement of samples using optical chips. Of course, it is to be appreciated that any one of the above embodiments or processes may be combined with one or more other embodiments or processes to provide even further improvements in finding and matching designs and advantages. For example, while the present disclosure emphasizes advantages of keeping fluid away from the optical coupling, it will be appreciated that other or further aspects can provide synergetic or separate advantages. Further aspects of the present disclosure may e.g. reside in advantages associated with methods and systems employing lenses for estabhshing a remote coupling with the optical chip instead of contacting the chip with optical fibers. Such remote coupling, as described herein, may be less sensitive to placement tolerance and/or pollution. In some cases, remote coupling with lenses can also be used to traverse a layer of fluid, although this may require some further alignment and/or cleaning of the coupling. In this regard it is preferably to use a combination of remote coupling via a fluid-free optical path.

Overall, it is appreciated that this disclosure offers particular advantages to chemical and biological analysis of samples, and in general can be applied for any application wherein free-space measurement of optical chips in small sample containers is desired. Finally, the above- discussion is intended to be merely illustrative of the present systems and/or methods and should not be construed as limiting the appended claims to any particular embodiment or group of embodiments. The specification and drawings are accordingly to be regarded in an illustrative manner and are not intended to limit the scope of the appended claims. In interpreting the appended claims, it should be understood that the word "comprising" does not exclude the presence of other elements or acts than those listed in a given claim; the word "a" or "an" preceding an element does not exclude the presence of a plurality of such elements; any reference signs in the claims do not hmit their scope; several "means" may be represented by the same or different item(s) or implemented structure or function; any of the disclosed devices or portions thereof may be combined together or separated into further portions unless specifically stated otherwise. The mere fact that certain measures are recited in mutually different claims does not indicate that a combination of these measures cannot be used to advantage. In particular, all working combinations of the claims are considered inherently disclosed.