METHODS FOR JOINING HIGH TEMPERATURE SUPERCONDUCTING COMPONENTS

Title:

METHODS FOR JOINING HIGH TEMPERATURE SUPERCONDUCTING COMPONENTS

Document Type and Number:

WIPO Patent Application WO/2000/074151

Kind Code:

A2

Abstract:

A method for joining high temperature superconducting components while minimizing critical current degradation is provided. The articles formed have critical currents that are at least 80 % of the critical current of the high temperature superconducting components. Components (12, 14) in the form of wires or tapes are soldered along and are of overlap by using a solder mateial (16) and covered with a protective material (20). The invention further provides splicing geometries that facilitate wrapping joined components around a mandrel, tube or the like with minimal critical current degradation and without kinking or flexion of the joined components.

Inventors:

BUZCEK DAVID M
SCUDIERE JOHN D
HARNOIS RICHARD E
SPREAFICO SERGIO
GHERARDI LAURA

Application Number:

PCT/US2000/015381

Publication Date:

December 07, 2000

Filing Date:

June 02, 2000

Export Citation:

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Assignee:

AMERICAN SUPERCONDUCTOR CORP (US)

International Classes:

H01B13/00; H01L39/02; (IPC1-7): H01L39/02

Foreign References:

EP0807994A2

1997-11-19

Other References:

PATENT ABSTRACTS OF JAPAN vol. 018, no. 262 (C-1201), 19 May 1994 (1994-05-19) & JP 06 040775 A (NIPPON STEEL CORP), 15 February 1994 (1994-02-15)
PATENT ABSTRACTS OF JAPAN vol. 015, no. 250 (E-1082), 26 June 1991 (1991-06-26) & JP 03 078979 A (HITACHI LTD), 4 April 1991 (1991-04-04)

Attorney, Agent or Firm:

Nugent, Elizabeth E. (Hall & Stewart Exchange Place 53 State Street Boston, MA, US)

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Claims:

WHAT IS CLAIMED IS:

1.

A high temperature superconducting article, comprising: a first high temperature superconducting component having first and second ends; a layer of a first solder material, a portion of the solder layer attached to at least a portion of the first high temperature superconducting component; a second high temperature superconducting component having first and second ends, at least a portion of the second high temperature superconducting component attached to a portion of the solder layer; and at least one protective layer connected to the first and second high temperature superconducting components, wherein the portion of the first high temperature superconducting component attached to the solder material and the portion of the second high temperature superconducting component attached to the solder material form an overlap segment having a critical current at least 80 % of the lesser of critical currents of the first and second high temperature superconducting components, the overlap segment critical current being measured over an article length at least 100 times the length of the overlap segment, where critical current is determined using a 1 yV/cm criterion.

2.	The article of claim 1, wherein the overlap segment has a critical current at least 85 % of the lesser of the critical currents of the first and second high temperature superconducting components.

3.	The article of claim 1, wherein the overlap segment has a critical current at least 90% of the lesser of the critical currents of the first and second high temperature superconducting components.

4.	The article of claim 1, wherein the overlap segment has a critical current at least 95 % of the lesser of the critical currents of the first and second high temperature superconducting components.

5.	The article of claim 1, wherein the overlap segment has a critical current at least 99 % of the lesser of the critical currents of the first and second high temperature superconducting components.

6.	The article of claim 1, wherein the first and second high temperature superconducting components comprise the same materials.

7.	The article of claim 1, wherein the first end of the first superconducting component has a substantially triangular end.

8.	The article of claim 7, wherein the first end of the second superconducting component has a substantially triangular end.

9.	The article of claim 8, wherein the first ends of the first and second high temperature superconducting components define the overlap segment length.

10.	The article of claim 1, wherein the first end of the first superconducting component has a substantially diagonal end.

11.	The article of claim 10, wherein the first end of the second superconducting component has a substantially diagonal end.

12.	The article of claim 11, wherein the first ends of the first and second high temperature superconducting components define the overlap segment length.

13.	The article of claim 1, wherein the first end of the first superconducting component has a substantially inverted triangular end.

14.	The article of claim 13, wherein the first end of the second superconducting component has a substantially inverted triangular end.

15.	The article of claim 14, wherein the first ends of the first and second high temperature superconducting components define the overlap segment length.

16.	The article of claim 1, wherein the protective layer comprises at least one of the group consisting of stainless steel, copper, copperberyllium alloys, nickelbase superalloys, and nickelironbase superalloys.

17.	The article of claim 1, wherein the first and second high temperature superconducting materials comprise at least one of (Bi, Pb) SSCO or YBCO.

18.	The article of claim 1, wherein the protective layer is attached by means of a second solder material.

19.	The article of claim 18, wherein the second solder material has a lower melting point than the first solder material.

20.

A method for joining at least two high temperature superconducting components, comprising: providing a first high temperature superconducting component having first and second ends; providing a second high temperature superconducting component having first and second ends; applying a solder layer to the first and second high temperature superconducting components to form a joint; and applying at least one protective layer to the first and second high temperature superconducting components, wherein the portion of the first high temperature superconducting component attached to the solder material and the portion of the second high temperature superconducting component attached to the solder material form an overlap segment having a critical current at least 80% of the lesser of critical currents of the first and second high temperature superconducting components, the overlap segment critical current being measured over an article length at least 100 times the length of the overlap segment, where critical current is determined using a 1 V/cm criterion.

21.	The method of claim 20, wherein the overlap segment has a critical current at least 85 % of the lesser of the critical currents of the first and second high temperature superconducting components.

22.	The method of claim 20, wherein the overlap segment has a critical current at least 90% of the lesser of the critical currents of the first and second high temperature superconducting components.

23.	The method of claim 20, wherein the overlap segment has a critical current at least 95 % of the lesser of the critical currents of the first and second high temperature superconducting components.

24.	The method of claim 20, wherein the overlap segment has a critical current at least 99 % of the lesser of the critical currents of the first and second high temperature superconducting components.

25.	The method of claim 20, wherein the first end of the first high temperature superconducting component is substantially triangular.

26.	The method of claim 25, wherein the first end of the second high temperature superconducting component is substantially triangular.

27.	The method of claim 20, wherein the first end of the first high temperature superconducting component is substantially diagonal.

28.	The method of claim 27, wherein the first end of the second high temperature superconducting component is substantially diagonal.

29.	The method of claim 20, wherein the first end of the first high temperature superconducting component is substantially inverted triangular.

30.	The method of claim 29, wherein the first end of the second high temperature superconducting component is substantially inverted triangular.

31.	The method of claim 20, wherein the protective layer is attached by means of a second solder layer.

32.	The method of claim 31, wherein the second solder layer has a lower melting temperature than the first solder layer.

Description:

INTERNATIONAL SEARCH !------------------- intern ial Application No .. patent family members PCT/US 00/15381 Patent document Publication Patent family Publication cited in search report date member (s) date EP 0807994 A 19-11-1997 JP 9306565 A 28-11-1997 AU 1909097 A 20-11-1997 CA 2204107 A 13-11-1997 JP 06040775 A 15-02-1994 DE 69325995 D 16-09-1999 DE 69325995 T 20-04-2000 EP 0634379 A 18-01-1995 WO 9320025 A 14-10-1993 US 5786304 A 28-07-1998 JP 03078979 A 04-04-1991 NONE

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