Title:
METHODS FOR LASER PROCESSING TRANSPARENT WORKPIECES USING PULSED LASER BEAM FOCAL LINES AND CHEMICAL ETCHING SOLUTIONS
Document Type and Number:
WIPO Patent Application WO/2019/079417
Kind Code:
A3
Abstract:
A method includes forming a closed contour line having a plurality of defects in a transparent workpiece such that the closed contour line defines a closed contour. A pulsed laser beam is directed through an aspheric optical element and into the transparent workpiece such that a portion of the pulsed laser beam directed into the transparent workpiece generates an induced absorption within the transparent workpiece, the induced absorption producing a defect within the transparent workpiece, and translating the transparent workpiece and the pulsed laser beam relative to each other along the closed contour line. The method further includes etching the transparent workpiece with a chemical etching solution at an etching rate of about 2.5 µm/min or less to separate a portion of the transparent workpiece along the closed contour line, thereby forming an aperture extending through the transparent workpiece, the aperture comprising an aperture perimeter extending along the closed contour.
Inventors:
BURKET ROBERT CARL (US)
LEVESQUE DANIEL WAYNE (US)
MARJANOVIC SASHA (US)
PIECH GARRETT ANDREW (US)
VANSELOUS HEATHER NICOLE (US)
WIELAND KRISTOPHER ALLEN (US)
LEVESQUE DANIEL WAYNE (US)
MARJANOVIC SASHA (US)
PIECH GARRETT ANDREW (US)
VANSELOUS HEATHER NICOLE (US)
WIELAND KRISTOPHER ALLEN (US)
Application Number:
PCT/US2018/056240
Publication Date:
June 13, 2019
Filing Date:
October 17, 2018
Export Citation:
Assignee:
CORNING INC (US)
International Classes:
B23K26/53; C03C15/00
Domestic Patent References:
| WO2016010954A2 | 2016-01-21 |
Foreign References:
| US20150166395A1 | 2015-06-18 | |||
| US20140147624A1 | 2014-05-29 | |||
| EP1614665A1 | 2006-01-11 | |||
| US20180215647A1 | 2018-08-02 |
Attorney, Agent or Firm:
MCGROARTY, John (US)
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