Title:
METHODS OF MANUFACTURING IC CARD CIRCUIT BOARD SUBSTRATES AND IC CARDS
Document Type and Number:
WIPO Patent Application WO/2019/051712
Kind Code:
A1
Abstract:
A method of manufacturing an integrated circuit (IC) card circuit board substrate (18) is disclosed as including steps (a) providing a substrate (12) with two opposite major surfaces (13) both covered by a layer of copper, (b) forming at least two holes (14) through the substrate, each said hole being of a diameter of no more than 0.50 mm, (c) depositing a layer of copper on an interior surface (16) of each of the two holes, the layer of copper covering at least part of each of the major surfaces of the substrate, (d) forming an electric circuit on at least one of the major surfaces of the substrate, and (e) depositing at least a layer of nickel (15) and a layer of gold (17) on the layer of copper
Inventors:
WU XIAOXING (CN)
Application Number:
PCT/CN2017/101735
Publication Date:
March 21, 2019
Filing Date:
September 14, 2017
Export Citation:
Assignee:
APPLY CARD TECH LIMITED (CN)
International Classes:
H05K1/18; H05K3/42
Foreign References:
| US20070045826A1 | 2007-03-01 | |||
| US5252383A | 1993-10-12 | |||
| US7993510B2 | 2011-08-09 | |||
| CN103531485A | 2014-01-22 | |||
| US20090107711A1 | 2009-04-30 | |||
| EP1249787A1 | 2002-10-16 | |||
| JP2002123809A | 2002-04-26 |
Attorney, Agent or Firm:
RUNPING&PARTNERS (CN)
Download PDF:
Previous Patent: METHOD AND DEVICE FOR STATE DISPLAY DURING VENTILATION PROCESS
Next Patent: MULTI-FUNCTIONAL HAND-HELD TOOL
Next Patent: MULTI-FUNCTIONAL HAND-HELD TOOL