METHODS AND STRUCTURE FOR IMPROVING WAFER BOW CONTROL

Title:

METHODS AND STRUCTURE FOR IMPROVING WAFER BOW CONTROL

Document Type and Number:

WIPO Patent Application WO2004064090

Kind Code:

A3

Abstract:

A method for controlling bow in wafers (50) which utilize doped layers is described. The method includes depositing a silicon-germanium layer (52) onto a substrate (14), depositing an undoped buffer layer (56) onto the silicon-germanium layer, and depositing a silicon-boron layer (58) onto the undoped layer.

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Inventors:

HORNING ROBERT D
SCULLARD TIMOTHY LOUIS
MCDONALD ROBINSON

Application Number:

PCT/US2004/000021

Publication Date:

September 10, 2004

Filing Date:

January 05, 2004

Export Citation:

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Assignee:

HONEYWELL INT INC (US)

International Classes:

B81B3/00; B81C1/00; (IPC1-7): B81B3/00

Foreign References:

DE19848298A1	2000-04-13
US5496436A	1996-03-05
US5279687A	1994-01-18
EP0651439A2	1995-05-03

Other References: