METHODS AND SYSTEMS FOR REMOVING CONTAMINATION FROM A WIRE OF A SAW

Title:

METHODS AND SYSTEMS FOR REMOVING CONTAMINATION FROM A WIRE OF A SAW

Document Type and Number:

WIPO Patent Application WO/2013/024451

Kind Code:

A3

Abstract:

A system (100) for ultrasonically cleaning one or more wires (102) of a wire saw (104) for slicing semiconductor or solar material (105) into wafers. The system (100) includes an ultrasonic transducer (302) connected to a sonotrode (304). The system (100) also includes a sonotrode plate adjacent to one or more of the wires (102). The sonotrode plate has an opening that exposes the sonotrode (304) to one or more of the wires (102). The system (100) further includes a tank (202) for delivering a flow of liquid to contact the sonotrode (304) and one or more of the wires (102). The tank (202) is positioned on the same side of the wires (102) as the sonotrode plate. The ultrasonic transducer (302) is configured to vibrate and form cavitations in the liquid for the removal of contaminants from a surface of one or more of the wires (102).

Inventors:

ZAVATTARI CARLO (IT)
SEVERICO FERDINANDO (IT)
VANDAMME ROLAND (US)
BONDA FABRIZIO (IT)

Application Number:

PCT/IB2012/054168

Publication Date:

April 11, 2013

Filing Date:

August 15, 2012

Export Citation:

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Assignee:

MEMC ELECTRONIC MATERIALS (IT)
ZAVATTARI CARLO (IT)
SEVERICO FERDINANDO (IT)
VANDAMME ROLAND (US)
BONDA FABRIZIO (IT)

International Classes:

B08B3/12; B08B7/02; B28D5/00

Foreign References:

US5512335A	1996-04-30
US20110174285A1	2011-07-21
JPH01216759A	1989-08-30
US3635762A	1972-01-18

Other References: