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Patent Searching and Data


Title:
MGB2 SUPERCONDUCTING WIRE, AND MANUFACTURING METHOD FOR SAME
Document Type and Number:
WIPO Patent Application WO/2019/150678
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a method for causing sufficient deformation in precursor particles even when a soft high-purity metal is used for an outer layer material in mechanical milling, and manufacturing an MgB2 superconducting wire that is exceptional in terms of both thermal stability and critical current characteristics. A method for manufacturing an MgB2 superconducting wire in which an MgB2 filament is covered by an outer layer material, the method comprising: a precursor-particle-synthesizing step in which magnesium powder and boron powder are subjected to a degree of shock that is insufficient for MgB2 to be clearly produced, and precursor particles in which boron particles are dispersed inside a magnesium matrix are produced; a filling step in which a metal tube is filled with the precursor particles; a wire-drawing step in which the metal tube filled with the precursor particles is processed to form a wire; and a heat treatment step in which the wire is heat-treated to synthesize the MgB2; wherein the method is characterized in that a portion of the wire-drawing step includes swaging.

Inventors:
KODAMA MOTOMUNE (JP)
TANAKA HIDEKI (JP)
SUZUKI TAKAAKI (JP)
KOTAKI HIROSHI (JP)
Application Number:
PCT/JP2018/040839
Publication Date:
August 08, 2019
Filing Date:
November 02, 2018
Export Citation:
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Assignee:
HITACHI LTD (JP)
International Classes:
H01B13/00; C01B35/04; C01G1/00; H01B12/10
Domestic Patent References:
WO2017179349A12017-10-19
WO2017130672A12017-08-03
WO2017179349A12017-10-19
Foreign References:
JP2008258158A2008-10-23
JP2001118437A2001-04-27
JP4259806B22009-04-30
JP2018015323A2018-02-01
Other References:
SUPERCOND. SCI. TECHNOL., vol. 30, 2017, pages 044006
SUPERCOND. SCI. TECHNOL., vol. 26, 2013, pages 025005
See also references of EP 3683808A4
Attorney, Agent or Firm:
HIRAKI & ASSOCIATES (JP)
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