Title:
MICRO ASSEMBLED HIGH FREQUENCY DEVICES AND ARRAYS AND METHOD OF MAKING THE SAME
Document Type and Number:
WIPO Patent Application WO/2015/193433
Kind Code:
A3
Abstract:
Phased-array antenna systems can be constructed using transfer printed active components. Phased-array antenna systems benefit from a large number of radiating elements (e.g., more radiating elements can form sharper, narrower beams (higher gain)). As the number of radiating elements increases, the size of the part and the cost of assembly increases. High throughput micro assembly(e.g. by micro-transfer printing)mitigates costs associated with high part-count. Micro assembly is advantaged over monolithic approaches that form multiple radiating elements on a semiconductor wafer because micro assembly uses less semiconductor material to provide the active components that are necessary for the array. The density of active components on the phased-array antenna system is small. Micro assembly provides a way to efficiently use semiconductor material on a phased array, reducing the amount of non-active semiconductor area (e.g.,the area on the semiconductor material that does not include transistors, diodes, or other active components).
Inventors:
BOWER CHRISTOPHER (IE)
MEITL MATTHEW (IE)
MEITL MATTHEW (IE)
Application Number:
PCT/EP2015/063708
Publication Date:
February 18, 2016
Filing Date:
June 18, 2015
Export Citation:
Assignee:
CELEPRINT LTD X (IE)
International Classes:
H01G4/30; H01L21/683; H01L49/02
Domestic Patent References:
| WO2010132552A1 | 2010-11-18 |
Foreign References:
| US20120313241A1 | 2012-12-13 | |||
| US20120249394A1 | 2012-10-04 |
Attorney, Agent or Firm:
KIRKHAM, Nicholas et al. (7-9 St Botolph's Road, Sevenoaks Kent TN13 3AJ, GB)
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