Title:
MICRO-BALL REMOVAL METHOD AND REMOVAL DEVICE, AND MICRO-BALL BATCH MOUNTING METHOD AND BATCH MOUNTING DEVICE
Document Type and Number:
WIPO Patent Application WO/2010/004983
Kind Code:
A1
Abstract:
Micro-balls (2) remaining on a vacuum plate (11) are removed using a ball removal implement (9) with a wire section that is stretched under tension, by bringing a wire (17) in contact with the micro-balls (2) remaining on the vacuum plate (11), while moving ball removal implement (9) in relation to the vacuum plate (11), and while moving the wire (17) in the wire section by extending and retracting said wire.
Inventors:
ISHIKAWA SHINJI (JP)
HASHINO EIJI (JP)
TATSUMI KOHEI (JP)
HASHINO EIJI (JP)
TATSUMI KOHEI (JP)
Application Number:
PCT/JP2009/062353
Publication Date:
January 14, 2010
Filing Date:
July 07, 2009
Export Citation:
Assignee:
NIPPON STEEL MATERIALS CO LTD (JP)
ISHIKAWA SHINJI (JP)
HASHINO EIJI (JP)
TATSUMI KOHEI (JP)
ISHIKAWA SHINJI (JP)
HASHINO EIJI (JP)
TATSUMI KOHEI (JP)
International Classes:
H01L21/60; H05K3/34
Foreign References:
| JP2003347339A | 2003-12-05 | |||
| JP2005056901A | 2005-03-03 | |||
| JP2003309140A | 2003-10-31 | |||
| JPH11224917A | 1999-08-17 |
Other References:
See also references of EP 2312623A4
Attorney, Agent or Firm:
KOKUBUN, Takayoshi (JP)
Takayoshi Kokubu (JP)
Takayoshi Kokubu (JP)
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