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Patent Searching and Data


Title:
MICRO-ELECTROMECHANICAL SYSTEM
Document Type and Number:
WIPO Patent Application WO/2012/002446
Kind Code:
A1
Abstract:
Disclosed is a micro-electromechanical system manufacturing method such that neither a vacuum processing process nor a lithography process is required, and that by using a mold wherein micro-structures are formed by machining, high-precision micro-electromechanical systems can be manufactured in large quantities by means of a forming process requiring only a small number of man-hours. A film wherein a functional layer and a mold release layer are formed by printing is positioned and pressure-bonded to a mold for forming a structure comprising a functional layer holding section which holds a functional layer of a micro-electromechanical system, and a frame which supports the functional layer holding section. Then the resin which is filled between the mold and the film is cured. Subsequently, the film is peeled off the mold, with the result that by means of the mold release layer, the structure comprising the functional layer holding section and the frame which supports the same is transcribed in the inside of the resin which is cured in the mold.

Inventors:
KURIHARA KAZUMA (JP)
KOBAYASHI TAKESHI (JP)
TAKAGI HIDEKI (JP)
Application Number:
PCT/JP2011/064935
Publication Date:
January 05, 2012
Filing Date:
June 29, 2011
Export Citation:
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Assignee:
NAT INST OF ADVANCED IND SCIEN (JP)
KURIHARA KAZUMA (JP)
KOBAYASHI TAKESHI (JP)
TAKAGI HIDEKI (JP)
International Classes:
B29C39/10; B81C1/00; B29C39/24; B29C45/16
Foreign References:
JP2000294580A2000-10-20
JP2008141044A2008-06-19
JP2002170921A2002-06-14
JPH08255806A1996-10-01
JP2008168506A2008-07-24
JPH1187433A1999-03-30
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Claims: