Title:
MICRO LED CHIP INTEGRATED IN ARRAY AND MANUFACTURING METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2021/129361
Kind Code:
A1
Abstract:
A micro LED chip integrated in an array and a manufacturing method therefor. The chip comprises a substrate (1), a conductive connection layer, a thermosetting buffer layer (3) and n light-emitting structures (4), wherein the conductive connection layer comprises a first metal connection layer (21) and a second metal connection layer (22); the first metal connection layer (21) enables first light-emitting micro structures (41) of the same column to form a conductive connection; and the second metal connection layer (22) enables two adjacent second light-emitting micro structures (42) of the same row to form a conductive connection. An integrated array of micro LED chips is formed in a full-common-cathode and double-common-anode manner, thereby improving the transfer efficiency and transfer yield of the chips.
Inventors:
XU LIANG (CN)
LEI ZIHE (CN)
LI CHENG (CN)
ZHUANG JIAMING (CN)
CUI YONGJIN (CN)
FAN KAIPING (CN)
LEI ZIHE (CN)
LI CHENG (CN)
ZHUANG JIAMING (CN)
CUI YONGJIN (CN)
FAN KAIPING (CN)
Application Number:
PCT/CN2020/134139
Publication Date:
July 01, 2021
Filing Date:
December 05, 2020
Export Citation:
Assignee:
FOSHAN NATIONSTAR SEMICONDUCTOR CO LTD (CN)
International Classes:
H01L33/36; H01L25/075
Foreign References:
CN110767642A | 2020-02-07 | |||
CN105742444A | 2016-07-06 | |||
US20090200560A1 | 2009-08-13 | |||
US20180047876A1 | 2018-02-15 | |||
CN108417682A | 2018-08-17 | |||
CN207852672U | 2018-09-11 |
Attorney, Agent or Firm:
SCIHEAD PATENT AGENT CO., LTD (CN)
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