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Patent Searching and Data


Title:
MICRO LED CHIP INTEGRATED IN ARRAY AND MANUFACTURING METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2021/129361
Kind Code:
A1
Abstract:
A micro LED chip integrated in an array and a manufacturing method therefor. The chip comprises a substrate (1), a conductive connection layer, a thermosetting buffer layer (3) and n light-emitting structures (4), wherein the conductive connection layer comprises a first metal connection layer (21) and a second metal connection layer (22); the first metal connection layer (21) enables first light-emitting micro structures (41) of the same column to form a conductive connection; and the second metal connection layer (22) enables two adjacent second light-emitting micro structures (42) of the same row to form a conductive connection. An integrated array of micro LED chips is formed in a full-common-cathode and double-common-anode manner, thereby improving the transfer efficiency and transfer yield of the chips.

Inventors:
XU LIANG (CN)
LEI ZIHE (CN)
LI CHENG (CN)
ZHUANG JIAMING (CN)
CUI YONGJIN (CN)
FAN KAIPING (CN)
Application Number:
PCT/CN2020/134139
Publication Date:
July 01, 2021
Filing Date:
December 05, 2020
Export Citation:
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Assignee:
FOSHAN NATIONSTAR SEMICONDUCTOR CO LTD (CN)
International Classes:
H01L33/36; H01L25/075
Foreign References:
CN110767642A2020-02-07
CN105742444A2016-07-06
US20090200560A12009-08-13
US20180047876A12018-02-15
CN108417682A2018-08-17
CN207852672U2018-09-11
Attorney, Agent or Firm:
SCIHEAD PATENT AGENT CO., LTD (CN)
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