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Title:
MICRO-LED CHIP TRANSFER METHOD AND DISPLAY DEVICE
Document Type and Number:
WIPO Patent Application WO/2021/000384
Kind Code:
A1
Abstract:
Disclosed in embodiments of the application are a micro-LED chip transfer method and a display device. The method comprises: providing a driving substrate, the driving substrate comprising a plurality of driving circuit units arranged in an array; providing an epitaxial wafer, the epitaxial wafer comprising a plurality of Micro-LED chips arranged in an array; and cutting the epitaxial wafer according to the rows of the array and the columns of the array to form a plurality of Micro-LED chips; and aligning the plurality of Micro-LED chips and transferring same to the driving substrate, each Micro-LED chip being electrically connected to a corresponding driving circuit unit in the plurality of driving circuit units.

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Inventors:
LIU ZHAOJUN (CN)
MO WEIJING (CN)
QIU CHENGFENG (CN)
Application Number:
PCT/CN2019/100968
Publication Date:
January 07, 2021
Filing Date:
August 16, 2019
Export Citation:
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Assignee:
SHENZHEN SITAN TECH CO LTD (CN)
International Classes:
H01L21/78; H01L21/67; H01L27/15; H01L33/48
Foreign References:
CN109473532A2019-03-15
CN108231653A2018-06-29
JP2003168559A2003-06-13
JP2002280174A2002-09-27
Attorney, Agent or Firm:
BEYOND ATTORNEYS AT LAW (CN)
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