MICRO LED DEVICE, AND METHOD FOR MANUFACTURING MICRO LED DEVICE

WIPO Patent Application WO/2020/121449

A1

This micro LED device of the present disclosure comprises: a plurality of micro LEDs (220) that respectively have a first semiconductor layer (21) of a first conductive type and a second semiconductor layer (22) of a second conductive type; as well as a front plane (200) that includes element isolation regions (240) positioned between the micro LEDs. The element isolation region has at least one metal plug (24) that is electrically connected to the second semiconductor layer. This device comprises: an intermediate layer (300) that includes a first contact electrode (31) that is electrically connected to the first semiconductor layer and a second contact electrode (32) that is connected to the metal plug; and a back plane (400) that is formed on the intermediate layer. This device further comprises a support substrate (500) that is fixed to at least one of the back plane and the front plane.

WO/2020/242116	DISPLAY DEVICE
WO/2009/106069	OPTOELECTRONIC SEMI-CONDUCTOR BODY AND METHOD FOR THE PRODUCTION THEREOF
WO/2024/006262	LIGHT-EMITTING DEVICE WITH REDUCED-AREA CENTRAL ELECTRODE

KISHIMOTO KATSUHIKO

PCT/JP2018/045729

June 18, 2020

December 12, 2018

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SAKAI DISPLAY PRODUCTS CORP (JP)

H01L33/38; H01L33/00

US20150325598A1	2015-11-12
JP2018533220A	2018-11-08
US20180151543A1	2018-05-31
CN108336097A	2018-07-27
JP2018523848A	2018-08-23
US5789766A	1998-08-04
US20180211991A1	2018-07-26
JP2016154213A	2016-08-25
US20160293586A1	2016-10-06

OKUDA Seiji (JP)

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