Title:
MICRO-NEEDLE ARRAY DEVICE
Document Type and Number:
WIPO Patent Application WO/2020/090845
Kind Code:
A1
Abstract:
The problem to be addressed by the present invention is to provide a micro-needle array device, the needle parts of which can be sufficiently dissolved. This micro-needle array device comprises a micro-needle array having a sheet part and a plurality of needle parts present on the upper surface of the sheet part, and a push member for pushing the surface of the sheet part on the other side from the surface having the needle, wherein the thickness of the sheet part is 0.1 to 0.6 mm and wherein the surface area A of the pushing surface of the push member pushing the sheet part of the micro-needle array and the surface area B of the region where the needles of the micro-needle array are present, satisfy 0.3 ≤ A/B ≤ 0.75.
Inventors:
YOSHIDA JUNYA (JP)
KABATA KOKI (JP)
KOBAYASHI YUKA (JP)
KABATA KOKI (JP)
KOBAYASHI YUKA (JP)
Application Number:
PCT/JP2019/042461
Publication Date:
May 07, 2020
Filing Date:
October 30, 2019
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
A61M37/00
Domestic Patent References:
| WO2016129184A1 | 2016-08-18 | |||
| WO2011089907A1 | 2011-07-28 |
Foreign References:
| JP2008520369A | 2008-06-19 | |||
| JPS46895A | ||||
| JP2018191783A | 2018-12-06 | |||
| JP6074889B2 | 2017-02-08 | |||
| JP2013027492A | 2013-02-07 |
Other References:
See also references of EP 3875141A4
Attorney, Agent or Firm:
SIKs & Co. (JP)
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