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Patent Searching and Data


Title:
MICRO-SILICON MICROPHONE AND MANUFACTURING METHOD THEREOF
Document Type and Number:
WIPO Patent Application WO/2018/094963
Kind Code:
A1
Abstract:
Provided are a micro-silicon microphone and a manufacturing method thereof for solving a technical problem in which sensitivity and a manufacturing process of a micro-silicon microphone are affected by stress of the micro-silicon microphone. The micro-silicon microphone of the present invention comprises a vibration film layer. The vibration film layer comprises vibration beams and a vibration film. The vibration beams are uniformly arranged around an edge of the vibration film. A first end of the vibration beam is fixed to the edge of the vibration film. A second end of the vibration beam is fixed to a supporting structure.

Inventors:
SUN, Kai (Room 102, NW-0999 Jinjihu Road, Suzhou Industrial Par, Suzhou Jiangsu 0, 215000, CN)
HU, Wei (Room 102, NW-0999 Jinjihu Road, Suzhou Industrial Par, Suzhou Jiangsu 0, 215000, CN)
LI, Gang (Room 102, NW-0999 Jinjihu Road, Suzhou Industrial Par, Suzhou Jiangsu 0, 215000, CN)
Application Number:
CN2017/081397
Publication Date:
May 31, 2018
Filing Date:
April 21, 2017
Export Citation:
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Assignee:
MEMSENSING MICROSYSTEMS (SUZHOU, CHINA) CO., LTD. (Room 102, NW-0999 Jinjihu Road, Suzhou Industrial Par, Suzhou Jiangsu 0, 215000, CN)
International Classes:
H04R31/00; H04R19/04
Attorney, Agent or Firm:
BRIGHTHEAD INTELLECTUAL PROPERTY AGENCY CO., LTD. (B228 No. 32, Inside the No. 5 Yard Guangshun North Street Chaoyang District, Beijing 2, 100102, CN)
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