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Patent Searching and Data


Title:
MICROBOLOMETER AND PREPARATION METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2023/141768
Kind Code:
A1
Abstract:
The present application provides a microbolometer and a preparation method therefor. In the microbolometer, a getter layer is integrated on a substrate below a bridge surface of a support bridge for supporting a thermally sensitive layer, and the microbolometer and the getter layer can be prepared by using an MEMS process, thereby facilitating optimizing the preparation process of the microbolometer. In addition, the getter layer is arranged inside the microbolometer, so that the microbolometer is not limited by the complexity of a packaging structure and the difficulty of a packaging process, the efficiency of production of the microbolometer can be effectively improved, and the production cost is reduced.

Inventors:
LIU JIWEI (CN)
HU HANLIN (CN)
GAN XIANFENG (CN)
SHI JIE (CN)
WANG XINGXIANG (CN)
Application Number:
PCT/CN2022/073846
Publication Date:
August 03, 2023
Filing Date:
January 25, 2022
Export Citation:
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Assignee:
YANTAI RAYTRON TECH CO LTD (CN)
International Classes:
H01L31/09; B81B7/04; B81C1/00; G01J5/02; G01J5/10; G01J5/20; H01L31/18
Foreign References:
CN102012269A2011-04-13
CN103776546A2014-05-07
CN105449008A2016-03-30
CN209027681U2019-06-25
CN106340561A2017-01-18
CN106052883A2016-10-26
US20040092041A12004-05-13
Attorney, Agent or Firm:
SHEN & PARTNERS (CN)
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