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Title:
MICROCAPSULE TYPE CURABLE RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2015/045830
Kind Code:
A1
Abstract:
The present invention provides a microcapsule type curable resin composition which produces substantially no gases when applied to an adherend, e.g., to a threaded member, which is then tightened, and which moreover, due to exceptional coating properties to an adherend, does not give rise to coating irregularities, and which additionally has exceptional adhesive strength and durability. The present invention is a microcapsule type curable resin composition containing (A) microcapsules encapsulating a curable compound (a), (B) a substance able to bring about curing of component (a), and (C) a binder able to adhere the microcapsules to an adherend, wherein the microcapsule type curable resin composition is characterized by including, per total 100 mass parts of all of the microcapsules, (D) 1-25 mass parts of mica having average particle diameter of 10-150 μm, and (E) 1-25 mass parts of an inorganic filler having average particle diameter of 3-50 μm, the mass ratio of component (D) and component (E) being 0.2-2.0 of component (E) with respect to 1.0 of component (D).

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Inventors:
ONODA TOMOHIRO (JP)
KAMATA KUNIHIKO (JP)
MAEDA YASUO (JP)
Application Number:
PCT/JP2014/073651
Publication Date:
April 02, 2015
Filing Date:
September 08, 2014
Export Citation:
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Assignee:
THREEBOND FINECHEMICAL CO LTD (JP)
International Classes:
C08F2/44; C08F2/00; C08G59/18
Domestic Patent References:
WO2005054393A12005-06-16
WO2005054393A12005-06-16
Foreign References:
JP2008056891A2008-03-13
JP2012010908A2012-01-19
JPH03292378A1991-12-24
JP2000191745A2000-07-11
JP2000239438A2000-09-05
JP2010205498A2010-09-16
JPH10252177A1998-09-22
JP2002212513A2002-07-31
JPH0742719A1995-02-10
JPS641780A1989-01-06
JPH09249872A1997-09-22
JPH1150013A1999-02-23
JPH10130587A1998-05-19
JPH11349917A1999-12-21
JPH01108284A1989-04-25
JP2000015087A2000-01-18
Other References:
See also references of EP 3050903A4
Attorney, Agent or Firm:
HIRAYAMA, KIYOTAKA (JP)
Kiyotaka Hirayama (JP)
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