Title:
MICROCHANNEL CHIP, MICROCHANNEL BASE MATERIAL, METHOD FOR FABRICATING MICROCHANNEL CHIP, AND METHOD FOR FABRICATING MICROCHANNEL BASE MATERIAL
Document Type and Number:
WIPO Patent Application WO/2023/248660
Kind Code:
A1
Abstract:
Provided are a microchannel chip, a microchannel base material with which said microchannel chip can be formed, and methods for fabricating the same, the microchannel chip suppressing breakage of a member caused by a pressure when a wall part and a lid member are bonded, and exhibiting no liquid leakage during liquid flowing. A microchannel chip (1) comprises: a substrate (10); a barrier layer (11) that is formed from a resin material and that is provided on the substrate (10) so as to form a channel section (13); and a cover layer (12) that is provided on a surface of the barrier layer (11) on the opposite side from the substrate (10) so as to cover the channel section (13). The channel section (13) is formed in the barrier layer (11) as an opening section having an open width of 2000 μm or less. The opening area percentage of the barrier layer (11) is 60% or less.
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Inventors:
HASE HINA (JP)
FUKUGAMI NORIHITO (JP)
FUKUGAMI NORIHITO (JP)
Application Number:
PCT/JP2023/018667
Publication Date:
December 28, 2023
Filing Date:
May 18, 2023
Export Citation:
Assignee:
TOPPAN HOLDINGS INC (JP)
International Classes:
G01N35/08; B81B1/00; B81C1/00; G01N37/00
Foreign References:
| JP2007064901A | 2007-03-15 | |||
| JP2020056790A | 2020-04-09 | |||
| JP2020188738A | 2020-11-26 | |||
| JP2018083294A | 2018-05-31 |
Attorney, Agent or Firm:
HIROSE Hajime et al. (JP)
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