Title:
MICROCHANNEL CHIP
Document Type and Number:
WIPO Patent Application WO/2019/230086
Kind Code:
A1
Abstract:
The present invention removes air bubbles trapped between the substrates when manufacturing a microchannel chip by bonding two substrates together. This microchannel chip has a chip body wherein: a first substrate and a second substrate are bonded together without interposing an adhesive therebetween; the first substrate has rubber elasticity; an open recess groove and a closed void are provided at the interface between the first substrate and the second substrate; the open recess groove is connected with outside air at one or more locations; and the closed void is shut off from both outside air and the open recess groove.
Inventors:
WATANABE FUMIAKI (JP)
Application Number:
PCT/JP2019/007340
Publication Date:
December 05, 2019
Filing Date:
February 26, 2019
Export Citation:
Assignee:
FUKOKU KK (JP)
International Classes:
G01N35/08; B01J19/00; B81B1/00; G01N37/00
Foreign References:
| JP2006317427A | 2006-11-24 | |||
| JP2009047626A | 2009-03-05 | |||
| JP2016017890A | 2016-02-01 |
Other References:
FUJII, TERUO: "Microfluidic Devices for Biological Applications", SEISAN KENKYU, vol. 55, no. 2, 2003, pages 121 - 126
"Mass Production Techniques Using Microchannel Chip Injection Molding. Our Proposal", TECHNICAL INTRODUCTION; GOMUSEIKEI.COM., Retrieved from the Internet [retrieved on 20190513]
"Mass Production Techniques Using Microchannel Chip Injection Molding. Our Proposal", TECHNICAL INTRODUCTION; GOMUSEIKEI.COM., Retrieved from the Internet
Attorney, Agent or Firm:
TSUKUNI & ASSOCIATES et al. (JP)
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