Title:
MICROCHANNEL CHIP
Document Type and Number:
WIPO Patent Application WO/2022/080077
Kind Code:
A1
Abstract:
The present invention provides a microchannel chip that comprises: a resin substrate, at least one surface of which is provided with a channel groove; and a resin film which comprises a base material layer and an adhesive layer, and which is bonded to the resin substrate by means of the adhesive layer so as to cover the channel groove. If X (μm) is the thickness of the base material layer of the resin film, and Y (μm) is the thickness of the adhesive layer of the resin film, all of the relational expressions (1) to (3) described below are satisfied. (1): Y ≥ 0.4X -25
(2): 50 ≥ Y ≥ 3
(3): X ≥ 40
Inventors:
YAKUMARU KOSUKE (JP)
Application Number:
PCT/JP2021/033930
Publication Date:
April 21, 2022
Filing Date:
September 15, 2021
Export Citation:
Assignee:
SUMITOMO BAKELITE CO (JP)
International Classes:
B81B1/00; B01J19/00; B29C65/48; B81C3/00; G01N35/08; G01N37/00
Foreign References:
| JP2007240461A | 2007-09-20 | |||
| JP2014206512A | 2014-10-30 |
Attorney, Agent or Firm:
TANAI Sumio et al. (JP)
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