Title:
MICROCHIP MANUFACTURING METHOD AND MICROCHIP
Document Type and Number:
WIPO Patent Application WO/2012/081584
Kind Code:
A1
Abstract:
Provided is a microchip manufacturing method comprising: a step in which a light-absorbing second substrate is disposed on the recess-containing surface of a light-transmitting first substrate that has a recess formed in one surface; and a step in which said first substrate and second substrate are welded together by shining light from the first-substrate side. Said manufacturing method manufactures a microchip wherein at least a portion of light shined towards the abovementioned recess is focused on the area where the first substrate and second substrate are bonded to each other. Also provided is the microchip obtained via said manufacturing method.
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Inventors:
MOMOSE SHUN (JP)
TAKEUCHI HIROKI (JP)
TAKEUCHI HIROKI (JP)
Application Number:
PCT/JP2011/078815
Publication Date:
June 21, 2012
Filing Date:
December 13, 2011
Export Citation:
Assignee:
ROHM CO LTD (JP)
MOMOSE SHUN (JP)
TAKEUCHI HIROKI (JP)
MOMOSE SHUN (JP)
TAKEUCHI HIROKI (JP)
International Classes:
G01N35/02; B01J19/00; B01J19/24; G01N37/00
Foreign References:
| JP2007307634A | 2007-11-29 | |||
| JP2000294013A | 2000-10-20 | |||
| JP2005119050A | 2005-05-12 | |||
| JP2003156474A | 2003-05-30 | |||
| JP2006142198A | 2006-06-08 | |||
| JPS6249850B2 | 1987-10-21 |
Attorney, Agent or Firm:
Fukami Patent Office, p. c. (JP)
Patent business corporation Fukami patent firm (JP)
Patent business corporation Fukami patent firm (JP)
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Claims: