Title:
MICROCHIP
Document Type and Number:
WIPO Patent Application WO/2018/109829
Kind Code:
A1
Abstract:
A microchip 1 comprising a chip body 2 in which a reaction space 3 having a lower pressure than atmospheric pressure is formed, wherein the chip body 2 has a two-layer structure consisting of a gas-impermeable first plate-shaped part 7 and a self-sealing second plate-shaped part 8 layered on one surface of the first plate-shaped part 7. The reaction space 3 is formed between the first plate-shaped part 7 and the second plate-shaped part 8.
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Inventors:
WATANABE HIDETOSHI (JP)
Application Number:
PCT/JP2016/087025
Publication Date:
June 21, 2018
Filing Date:
December 13, 2016
Export Citation:
Assignee:
EIKEN CHEMICAL (JP)
International Classes:
C12N15/09; C12M1/00; G01N37/00; C12Q1/68
Domestic Patent References:
| WO2013132891A1 | 2013-09-12 | |||
| WO2014010299A1 | 2014-01-16 | |||
| WO2013157667A1 | 2013-10-24 |
Foreign References:
| JPS5218443B2 | 1977-05-21 | |||
| JP2014132228A | 2014-07-17 | |||
| JP2008211967A | 2008-09-18 | |||
| JP2016211871A | 2016-12-15 | |||
| JPS5218443B2 | 1977-05-21 |
Other References:
See also references of EP 3556853A4
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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