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Patent Searching and Data


Title:
MICROCHIP
Document Type and Number:
WIPO Patent Application WO/2018/216673
Kind Code:
A1
Abstract:
The objective of the present invention is to provide a microchip in which a high-strength joining state is achieved in a joint portion of two substrates. A microchip (10) is formed by joining a first microchip substrate (11) and a second microchip substrate (16) together, and internally includes a flow passage (R) which allows an injection port and a discharge port, provided in a top surface of the first microchip substrate, to communicate with one another, and which comprises a flow passage channel formed in at least one of the first microchip substrate and the second microchip substrate. The microchip (10) is characterized in that between the first microchip substrate and the second microchip substrate are formed inside joint portions (21, 22) formed along the flow passage, and an outside joint portion formed along outer peripheral edge portions of each of the first microchip substrate and the second microchip substrate, and in that a sealed space (S) is formed between the inside joint portions and the outside joint portion in such a way as to surround the flow passage.

Inventors:
WASAMOTO MAKOTO (JP)
SAKAI MOTOHIRO (JP)
SUZUKI SHINJI (JP)
Application Number:
PCT/JP2018/019577
Publication Date:
November 29, 2018
Filing Date:
May 22, 2018
Export Citation:
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Assignee:
USHIO ELECTRIC INC (JP)
International Classes:
G01N35/08; G01N37/00
Domestic Patent References:
WO2012057099A12012-05-03
Foreign References:
JP2010043928A2010-02-25
JP2005329333A2005-12-02
JP2010078402A2010-04-08
JP2006053094A2006-02-23
JP2014020920A2014-02-03
JP2006119051A2006-05-11
Attorney, Agent or Firm:
FUJIMOTO Nobuo et al. (JP)
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