CONVERTER

CROSS REFERENCE TO RELATED APPLICATIONS

This application claims priority to U.S. Provisional Application Serial No. 61/544,208 titled, "Microcontroller with Sequencer Driven ADC," filed October 6, 201 1 , which is hereby incorporated by reference in its entirety as if fully set forth herein.

TECHNICAL FIELD

The present disclosure relates to analog to digital converters in particular for use in a microcontroller and, more particularly, for use in microcontrollers with capacitive touch sensing circuitry.

BACKGROUND

Touching of a capacitive sensor by a human hand or finger, or approaching a capacitive proximity sensor changes certain parameters thereof, in particular the capacitance value of a capacitor that is built into the touch sensor used, for example, in human to machine interface devices, e.g., keypad or keyboard. Microcontrollers now include peripherals that enhance the detection and evaluation of such capacitive touch sensors. One such application utilizes capacitive voltage division (CVD) to evaluate whether a capacitive touch element has been touched or not. The CVD conversion process requires that the sensor and ADC sample- and-hold capacitors be charged/discharged/connected for precise time periods to achieve full resolution with minimum noise.

Typical systems use software to perform the CVD conversion. However, this requires high processor overhead and usage of significant amounts of program memory, and achieves only coarse timing resolution. Hence there exists a need for an improved microcontroller capable of interfacing with capacitive touch sensors. SUMMARY

According to various embodiments, an automated sequencer is provided which makes the CVD conversion process a hardware function. The sequencer controls the charging discharging of the sensor and ADC sample-and-hold capacitances, as well as the voltage division process. It also initiates the ADC conversion, with an optional second conversion for greater resolution, or a differential conversion.

A microcontroller in accordance with some embodiments includes at least one analog input port coupled with a first external pin of the microcontroller which can be coupled with an external sensor capacitor and a capacitive touch sensor peripheral. The capacitive touch panel peripheral includes an analog to digital converter for measuring a capacitance of the external sensor capacitor; a pre-charge unit operable to independently pre-charge the external sensor capacitor and an internal sample & hold capacitor of the ADC to a selected pre-charge voltage; and a sequencer operable to be programmed to determine a timing sequence for pre- charging said external and internal capacitors, parallel switch said internal and external capacitors to share a charge and control the ADC to measure the shared charged.

A microcontroller according to another embodiment includes at least one analog input port coupled with a first external pin of the microcontroller which can be coupled with an external sensor capacitor, a capacitive touch sensor peripheral including an analog to digital converter for measuring a capacitance of the external sensor capacitor, the capacitor touch sensor peripheral configured to independently pre-charge the external sensor capacitor and an internal sample & hold capacitor of the ADC to a selected pre-charge voltage and programmable to determine a timing sequence for pre -charging said external and internal capacitors, parallel switch said internal and external capacitors to share a charge and control the ADC to measure the shared charged. BRIEF DESCRIPTION OF THE DRAWINGS

Fig. 1 illustrates a schematic block diagram of an electronic system having a capacitive touch keypad, a capacitive touch analog front end and a digital processor, according to an embodiment;

Fig. 2 is a high-level block diagram of an ADC system according to various embodiments; Figs. 3A and 3B show various switches used according to various embodiments;

Figs. 4A and 4B illustrate multi-function port logic that supports a digital I O and an analog function via an analog pass gate switch wherein the analog function can be overridden to precharge and discharge a capacitive touch sensor connected to the port with ADC controller logic, according to the teachings of this disclosure;

Fig. 5 shows an exemplary timing of an automated analog to digital conversion according to various embodiments;

Fig. 6 shows switch positions during the pre-charge phase;

Fig. 7 shows switch positions during the acquisition share phase;

Fig. 8 shows a block diagram of an ADC module according to an embodiment;

Fig. 9 illustrates a schematic diagram of a mixed signal integrated circuit device having CVD processing capabilities for a capacitive sensor and associated guard ring, according to a specific example embodiment of this disclosure;

Fig. 10 illustrates a schematic diagram of a mixed signal integrated circuit device having CVD processing capabilities for a plurality of capacitive sensors and a guard ring, according to another specific example embodiment of this disclosure;

Fig. 1 1 illustrates a schematic diagram of a mixed signal integrated circuit device having CVD processing capabilities for a capacitive sensor and associated guard ring, according to a specific example embodiment of this disclosure;

Fig. 12 illustrates a schematic diagram of a mixed signal integrated circuit device having CVD processing capabilities for plurality of capacitive sensors and a guard ring, according to another specific example embodiment of this disclosure;

Fig. 13 illustrates a schematic voltage-time diagram of capacitance conversions, according to specific example embodiments of this disclosure;

Fig. 14 illustrates a schematic voltage-time diagram of capacitance conversions and guard ring voltage control during these conversions, according to specific example embodiments of this disclosure;

Fig. 15 illustrates a schematic timing diagram of the capacitive conversion system shown in Fig. 7; and Fig, 16 illustrates a schematic timing diagram of the capacitive conversion system shown in Figs. 1 1 and 12;

Figs. 17 and 18 show schematic process flow diagrams of capacitive conversions, according to a specific example embodiment of this disclosure.

Figs. 1 and 20 illustrate schematic process flow diagrams of capacitive conversions, according to another spe ific example embodiment of this disclosure;

Fig. 21 illustrates a schematic elevational view of capacitive sensor keys shown in Fig. 1 ; and

Fig. 22 illustrates a schematic elevational view of capacitive sensor keys shown in Fig. 1 and having capacitive guard rings around each of the capacitive sensors, according to a specific example embodiment of this disclosure.

DETAILED DESCRIPTION

According to embodiments, a sequencing peripheral implements the typical CVD conversion sequence. In some embodiments, the conversion is started with only a single bit initiation from the control software; in others, a hardware trigger such as a timer overflow may be used. The sequencer can be a programmable state machine wherein a plurality of control registers allow for setting the pre-charge time, the acquisition time and whether one or more measurements are performed sequentially. In particular one embodiment may provide for a double ADC measurement wherein a further control bit controls whether a differential measurement is to be performed. In a differential mode, the external sensor capacitor is discharged while the internal sample & hold capacitor is pre-charged to the supply voltage during the first measurement. The following second measurement reverses this and pre-charges the external sensor capacitor while the internal sample & hold capacitor is discharged. The acquisition/share periods remain the same and couple the external and internal capacitors to share their charges. The results are stored in two special function registers. Thus, a differential result can be obtained. Using the programmable ADC sequencer, a user merely needs to initialize the system properly and for the conversion proper, in some embodiments, only a single bit in a control register needs to be set to start the fully automated measuring process for an external touch sensor. In other embodiments, a hardware trigger begins the measuring process. Once all results have been properly stored in the registers, the sequencer can initiate an interrupt signal, A currently running program is then interrupted and an associated interrupt service routine can handle/retrieve/process the sampled data.

More particularly, and as will be discussed in greater detail below, a CVD conversion according to embodiments employs a "sequencer" to implement a pre-charge phase and a sharing/acquisition phase prior to a conversion phase. During pre-charge, internal and external capacitors are charged and discharged; during sharing acquisition, external and internal capacitors share a charge.

Referring now to the drawings, the details of specific example embodiments are schematically illustrated. Like elements in the drawings will be represented by like numbers, and similar elements will be represented by like numbers with a different lower case letter suffix.

Referring to Fig. 1, depicted is a schematic block diagram of an electronic system having a capacitive touch keypad, a capacitive touch analog front end and a digital processor, according to the teachings of this disclosure, A microcontroller integrated circuit device 101 may include a digital processor and memory 106, an analog-to-digital converter (ADC) controller 1 10, one or more of input-output (I/O) ports (nodes), an analog-to-digital converter (ADC), precision timers, multifunction input and output nodes, digital-to-analog converter (DAC) or combinations thereof. A capacitive touch analog front end (AFE) 104 may be implemented with some of the aforementioned functions of the microprocessor 101 . The capacitive touch AFE 104 may be coupled to a matrix of capacitive sensor keys 102, e.g., pushbuttons, levers, toggles, targets, handles, knobs, etc., through an analog multiplexer (not shown).

The ADC controller 1 10 and capacitive touch AFE 104 facilitate, with a single low- cost integrated circuit microcontroller 101 , all active functions needed in determining when there is actuation of capacitive sensors, e.g., by pressing and deflecting a target key that changes the capacitance value of an associated capacitive sensor. The capacitive touch AFE 104 measures the capacitance value of each sensor of the matrix of capacitive sensor keys 102 and converts the capacitance values into respective analog direct current (DC) voltages that are read and converted into digital values with an analog-to-digital converter (ADC) (not shown) and read by the digital processor 106. The ADC controller 1 10 may control the capacitive touch AFE 104 _» switches for charging and discharging the capacitance touch sensors of the keys 102, timing of the steps required in determining capacitance values, sampling and conversion of the charge voltage on a sample and hold capacitor of an analog-to-digital converter (ADC), etc. The ADC controller 1 10 may be programmable and its programmable parameters stored in registers (not shown).

The digital processor 106 may supply clock and control request functions to the ADC controller 1 10, read the digital output from the ADC, and select each key of the matrix of capacitive sensor keys 102. When actuation of a key of the matrix of capacitive sensor keys 102 is determined, the digital processor 106 will take an appropriate action. More detailed descriptions of various capacitive touch systems are more fully disclosed in Microchip Technology Incorporated application notes AN1298, AN1325 and AN 1 34, available at www.microchip.com, and are hereby incorporated by reference herein for all purposes.

Turning now to Figure 2, a high-level block diagram illustrating an ADC circuit according to embodiments is shown. The circuit 200 includes an ADC core 202 including a sample and hold capacitor 203. Sample and hold pull up/down switches 204 operate to charge/discharge an analog bus 205, as will be explained in greater detail below. When the switches are open, the circuit acts as a traditional ADC. The switches allow the CVD sequencer to pre-charge the ADC sample and hold capacitor 203 to Vdd or Vss.

Additional sample and hold capacitors 208 couple to the bus and are program m ably operable for setting a total sample and hold capacitance for maximum resolution. The circuit 2(H) may further include port logic 212 coupled to nodes 21 1 , which receive inputs from sensor capacitors 210. In addition, logic 214 may provide a direct analog connection to a node (pin) 213 to override port logic 212.

Figures 3 A and 3B show a bank of adjustable ADC sample-and-hold capacitor(s) 208 in greater detail. During the course of a CVD (capacitive voltage division) conversion, the internal sample-and-hold capacitance 203 (FIG. 2) is charged. At the same time, the sensor capacitor 210 (FIG. 2) is discharged. When the two capacitances are connected, they divide the charge in the sample-and-hold capacitor.

More particularly, as shown in Fig. 3 A, a plurality of nodes 21 1 may be coupled to and from an analog bus 205, e.g., selection of each of a plurality of capacitive touch sensors. A direct connection may couple together the node 213 and the analog bus 205, A switch 302 may couple and decouple additional sample and hold capacitor 208 to and from the analog bus 205, The pull up/down switches 204 may be used to charge the analog bus 205 to Vdd, and discharge the analog bus 205 to Vss.

Referring to Fig, 3B, depicted is a schematic block diagram of analog and digital connection configurations, according to another embodiment. A plurality of analog pass gate switches 304 may implement an analog multiplexer and couple and decouple a plurality of nodes 21 1 to and from analog bus 205, e.g., selection of each of a plurality of capacitive touch sensors. Either a direct connection couples together the node 213 and the analog bus 205, or an optional analog pass gate switch 306 may couple and decouple the node 213 to and from the analog bus 205. The additional pass gate switch 306 can be part of the analog multiplexer if die multiplexer is designed to allow more than one switch to be closed. A plurality of switches 302 may couple and decouple additional sample and hold capacitors 208 to and from the analog bus 205. The pull up/down switches 204 may be used to charge the analog bus 205 to Vdd, and discharge the analog bus 205 to Vss.

As noted above, the number and capacitance value(s) of the additional sample and hold capacitors 208 may be programmed into one or more registers of the ADC controller 1 10, for example, during manufacturing or by a programmer in response to a calibration phase (not shown). The additional sample and hold capacitances 208 are then used in conj unction with the standard sample and hold capacitor for CVD conversion, as will be explained in greater detail below. In addition, a CVD sequencer can control a pre-charge and acquisition phase by controlling one or more pass switches, as will be explained in greater detail below.

Referring to Figure 4A, depicted is a schematic block diagram of multi-function port logic 212 that supports a digital I/O and an analog function via an analog pass gate switch wherein in addition the analog function can be overridden to precharge and discharge a capacitive touch sensor connected to the port with ADC controller logic, as will be discussed in greater detail below. Such a port logic may be used for any of the external pins 21 1 and when the analog multiplexer is configured to allow more than one switch to be closed then also for pin 21 1 . Switching between digital and analog functions at the node 21 lean be processor intensive and may require a complex program to properly handle all related digital and analog functions required of the node 21 1 , as more fully described below. In order to take the load, e.g., program steps and/or control functions, off of the processor 106 during setup and determination, of the capacitance value of each capacitive sensor, an ADC override feature may be incorporated into the capacitive touch determination circuits described herein.

Use of a dedicated ADC controller incorporating the circuit functions shown in Figure 4A will save digital processor program steps and allow for the processor to perform other functions during determination of the capacitive sensor capacitance. However, according to other embodiments, the override function can also be omitted.

Returning to Figure 4A, a digital driver 404 having a tri-state output is coupled to the external node 21 1 and is controlled by a tri-state control signal from a multiplexer 408. A digital output signal from a multiplexer 408 is coupled to an input of the digital driver 404. An analog pass gate switch 304 is controlled by analog switch logic 402, When the ADC override enable signal is at a logic low the multiplexer 408 couples the tri-state control signal to control the tri-state output of the digital driver 404, and the multiplexer 406 couples the digital output signal to the input of the digital driver 404. The ADC channel select (analog bus control) controls the analog pass gate switch 304 to directly couple the node 21 l to the analog bus 205, as more fully described below.

However, when the ADC override enable signal is at a logic high, the multiplexer 408 couples the ADC override data enable signal to control the tri-state output of the digital driver 404, and the multiplexer 406 couples the ADC override data signal to the input of the digital driver 404. The analog pass gate switch 304 is forced to decouple the analog bus 205 from the node 21 1 . In this configuration, the ADC override data enable and ADC override data signals may be provided by an ADC logic controller (not shown), and may be used to charge or discharge a capacitive touch sensor coupled to the node 21 1 without requiring program intensive actions from the digital processor 106.

Also, according to yet other embodiments, the port logic as shown may be used to create a universal port logic for each external pin, as for example, shown in Figure 4B. Thus, a universal port logic for all external pins may have two pass gates 304a, 304b which can be controlled independently to connect to the analog bus 205 or may have a single pass gate which is part of the analog multiplexer that allows to be controlled by an independent enable signal. More particularly, as shown in Figure 4B, additional logic 420, 426, 428 is provided to select for operation of pass gate 304a, 304b to bypass port logic. As noted above, and as will be discussed in greater detail below, a CVD conversion according to embodiments may implement a pre-charge phase and a sharing/acquisition phase prior to a conversion phase. During pre-charge, internal and external capacitors are charged and discharged; during sharing/acquisition, external and internal capacitors share a charge. The functionality implemented by the sequencer is illustrated more particularly with reference to Figure 5-7,

Figure 5 illustrates exemplary timing for the pre-charge and sharing acquisition phases, in particular, in some embodiments, the pre-charge phase 502 is an optional 1- 127 instruction cycle time used to put the external channel 210 and internal sample and hold capacitor 203 into preconditioned states. During this phase (Figure 6), the sample and hold capacitor 203 is shorted to either Vdd or Vss (depending on pull up/down circuitry 204), the port pin logic 601 is overridden, and the analog multiplexer 602 is forced open.

Returning to Figure 5, the sharing/acquisition time 504 according to some embodiments is also an optional 1- 127 instruction cycle time used to allow the voltage on the internal sample and hold capacitor 203 to charge or discharged from the selected analog channel. At the start of the acquisition stage 504, as shown in Figure 7, the selected ADC channel i connected to the sample and hold capacitor 203 with multiplexer 602. If the previous stage was the pre-charge stage, the time allows charge sharing between an external channel and the sample and hold capacitor.

Referring now to Figure 8, a diagram illustrating an exemplary ADC module in accordance with embodiments is shown. The module includes a digital control 1 10 and analog front end 104. The controller 1 1 includes register logic 802 and control logic 806. The register logic 802 may be programmed with a variety of controls, including controls for the sw itches that control the additional capacitances 206. In addition, the register logic may be programmed with controls for operating the sequencer, implemented by control logic 806.

Exemplary capacitive sensor keys suitable for use in embodiments as described are shown in Figure 21 and Figure 22.

Referring now to Figure 21 , depicted is a schematic elevational view of capacitive sensor keys shown in Figure 1 . A substrate 2004, e.g., printed circuit board (PCB), may have a ground plane 2006 that may be used for electromagnetic interference (EMI) shielding. Capacitive sensor plates 2008 may be transposed on a face of the substrate 2004 and in proximity to the ground plane 2006. Other circuit conductors 2010 (e.g., PCB traces) may also be in close proximity to the capacitive sensor plates 2008. Touch targets 212 lay over respective ones of the capacitive sensor plates 2008 and may have an air gap 2014 therebetween. Coverings 2016 may be placed over or be part of the touch targets 2012 and may have alpha-numerical information engraved thereon. Each of the capacitive touch keys 108 comprises a sensor plate 2008, touch target 2012 and covering 2016. Dielectric spacers 2018 are located between each of the capacitive touch keys 108.

The ground plane 2006 and or circuit conductors 2010 may be at different voltage potentials then the capacitive sensor plates 2008. This can create parasitic capacitance between the capacitive sensor plate 2008 and portions of the ground plane 2006 and/or circuit conductors 2010 in close proximity to the capacitive sensor plate 2008.

Referring to Figure 22, depicted is a schematic elevational view of capacitive sensor keys shown in Figure 1 and having capacitive guard rings around each of the capacitive sensors, according to a specific example embodiment of this disclosure. A guard ring 3020 around each of the capacitive sensor plates 2008 is added to the capacitive sensor keys 102a. Otherwise all other elements are substantially the same as the capacitive sensor keys 102 shown in Figure 21. By maintaining a voltage on the guard rings 3020 that is substantially the same as the voltage on the respective capacitive sensor plate 2008, parasitic capacitances are significantly reduced. Thereby increasing detection resolution of a change in the capacitance value of the capacitor sensor plate 2008 occurring during a touch thereto. In addition, providing for enhanced noise shielding does not affect the detection resolution as it would in the configuration shown in Figure 20. In such an embodiment, there is substantially no parasitic capacitance between the capacitive sensor plate 208 and the guard ring 320 because both are at substantially the same voltage potential.

Referring to Figure 9, depicted is a schematic diagram of a mixed signal integrated circuit device having CVD processing capabilities for a capacitive sensor and an associated guard ring, according to a specific example embodiment of this disclosure. The mixed signal integrated circuit device 101 shown in Figure 9, e.g., a microcontroller, is applicable when using the capacitive voltage divider (CVD) method of determining the capacitance value of the capacitive sensor plate 2008. By first determining the capacitance value of an untouched capacitive sensor plate 2008 and then determining a subsequent capacitance value of a touched capacitive sensor plate 2008, a touch to that capacitive sensor plate 2008 may be determined based upon the change in capacitance thereof. In CVD two capacitors are charged/discharged to opposite voltage values. Then the two oppositely charged capacitors are coupled together and a resulting voltage is measured on the connected two capacitors, A more detailed explanation of CVD is presented in commonly owned United States Patent Application Publication No, US 2010/0181 180, incorporated by reference herein for all purposes. The switches shown in Figure 9 may be, for example but are not limited to, field effect transistor (FET) switches. The nodes 928 and 930 are analog nodes coupled to respective internal single line (conductor) analog buses 932 and 934, respectively.

The capacitance of the capacitive sensor plate 2008 is represented by variable capacitor 904 (first CVD capacitor), and the second CVD capacitor may be the sample and hold capacitor 916 if these two capacitors have fairly close capacitive values e.g., 1 : 1 to about 3: 1. The reason for this in CVD is that part of the charge from one capacitor is transferred to the other capacitor having no charge or an opposite charge. For example, when the two CVD capacitors are equal in value, half of the charge on one will be transferred to the other capacitor, A two to once capacitance ratio will result in 1/3 of the charge being transferred to or taken from the smaller (1/2C) capacitor depending upon which of one the capacitors was initially charged. When the sample and hold capacitor 916 is substantially smaller than the capacitive sensor capacitor 904, additional capacitance 906a may be added externally to node 928, and/or internal capacitance 906b may be added independently of node 928 so that the combined capacitance of the capacitors 916, 906a and/or 906b have sufficient capacitance in relation to the capacitance value of the capacitive sensor capacitance 904 to meet the criteria above. This results in the best resolution in determining a capacitance value using CVD. Capacitor 916 is also the sample and hold capacitor used to sample and hold the analog voltage resulting after charge is transferred between the two CVD capacitors. Once the charge transfer is complete, an analog-to-digital converter (ADC) 918 converts the resulting charge voltage to a digital value that is read by the ADC controller 1 10 / digital processor 106 for further processing and determination of the capacitance value of the touch sensor capacitor 904.

In the example hereinafter presented, the capacitance values for the capacitor 904 (first CVD capacitor), capacitor 906a (an externally connected capacitor) and/or capacitor 906b (an internally connected capacitor) may be selected in combination with the sample and hold capacitor 916 to result in a combined charge voltage of 1/3 or 2/3 of the Vdd voltage depending on whether the first CVD capacitor 904 is discharged to Vss or charged to Vdd, and the combination of capacitors 906 and 916 are charged to Vdd or discharged to Vss, respectively. In this example, the capacitor 904 is about twice the capacitance as the capacitance of the parallel connected combination of capacitors 906 and 916. The resulting quiescent voltage after coupling the two opposite polarity charged CVD capacitors together will be about 1/3 * Vdd when the capacitor 904 was initially discharged to Vss, and about 2/3 · Vdd when the capacitor 904 was initially charged to Vdd.

Knowing the expected quiescent voltages of the combination of all capacitors connected in parallel allows creating the appropriate voltages for the guard ring 3020 surrounding the respective sensor plate 208 being evaluated for a capacitance value by the digital processor 106. When Vdd is desired on the guard ring 3020, both outputs from the digital drivers 912 and 14 are at substantially Vdd (logic high). When Vss is desired on the guard ring 3020, both outputs from the digital drivers 912 and 914 are at substantially Vss (logic low). When 1/3 * Vdd is desired on the guard ring 3020, the output from the digital driver 914 is at Vss (logic low) and the output from the digital driver 912 is at substantially Vdd (logic high). When 2/3 * Vdd is desired on the guard ring 3020, the output from the digital driver 914 is at Vdd (logic high) and the output from the digital driver 912 is at substantially Vss (logic low).

By proper selection of a capacitance value for capacitor 906, and resistance values for resistors 908 and 910, guard ring voltages may easily be generated by the ADC controller 1 10 using just two digital outputs at nodes 924 and 926. Other voltage ratios may also be effectively used by proper selection of values for capacitor 906 and resistors 908 and 910. For example, if the combined capacitance of capacitors 906 and 916 are substantially equal to the capacitance of capacitor 904, the subsequent combined voltage will be 1/2 *Vdd and the resistors 908 and 10 will be substantially the same resistance to produce 1 /2 *Vdd on the guard ring capacitance when appropriate.

Referring to Figure 10, depicted is a schematic diagram of a mixed signal integrated circuit device having CVD processing capabilities for a plurality of capacitive sensors and a guard ring, according to another specific example embodiment of this disclosure. The mixed signal integrated circuit device 101b shown in Figure 10, e.g., a microcontroller, operates in substantially the manner as the device 101 a shown in Figure 9 except that there is only one single wire analog bus 932a; wherein internal capacitors 906b and 906c are decoupled from the bus 932a with switches H, and the external node 928 is decoupled from the bus 932a with switch G. Only one set of Vdd Vss switches D and C are used wherein the first CVD capacitor 904 is charged/discharged during a different time period then the second CVD capacitor 916 (and 906) is discharged/charged. This saves a set of switches and a second internal analog bus (see Figure 9 bus 934).

In addition, a plurality of switches I are used to multiplex each of the capacitive sensors 904 used in the capacitive touch keys 108 shown in Figure 1. These features may also be incorporated into the circuit of Figure 9. The analog multiplexer switches I select respective ones of the plurality of sensor capacitors 904 as the capacitive touch analog front end 104 scans the capacitive touch keys 108. The plurality of nodes 930 are typically multipurpose programmable analog or digital inputs and/or outputs. For explanatory clarity in this disclosure only analog input/output (two way) configured nodes are shown. The digital processor, through the digital drivers 912 and 914, drives nodes 924 and 926 to appropriate logic levels for the selected one of the plurality of sensor capacitors 904.

Referring to Figure 1 1 , depicted is a schematic diagram of a mixed signal integrated circuit device having CVD processing capabilities for a capacitive sensor and associated guard ring, according to a specific example embodiment of this disclosure. The mixed signal integrated circuit device 101 b shown in Figure 1 1 , e.g., a microcontroller, operates in substantially the manner as the device 101 a shown in Figure 9.

Optionally, an analog buffer driver 914 having a high input impedance may be coupled to node 930 which is also coupled to the capacitor 904. The analog buffer driver 914 has a low impedance output that may be switchably coupled through switch J to the node 926 that is also coupled to the guard ring capacitance 902. The output voltage of the analog buffer driver 914 faithfully follows the voltage at the input thereto. Therefore, the voltage on the guard ring 3020 substantially follows the voltage on the respective sensor plate 208 being evaluated for a capacitance value by the digital processor 106.

Referring to Figure 12, depicted is a schematic diagram of a mixed signal integrated circuit device having CVD processing capabilities for a plurality of capacitive sensors and a guard ring, according to another specific example embodiment of this disclosure. The mixed signal integrated circuit device l Ol d shown in Figure 12, e.g., a microcontroller, operates in substantially the manner as the device 101 a shown in Figure 10. Optionally, an analog buffer driver 914 having a high input impedance may be coupled between the node 926 and the single wire analog bus 932a through switch J when the selected one of the plurality of capacitors 904 is being charged/discharged. The analog buffer driver 14 has a low impedance output coupled to the node 926 which is coupled to the guard ring capacitance 902. The output voltage of the analog buffer driver 914 faithfully follows the voltage on the selected one of the plurality of capacitors 904.

With respect to Figures 9 through 12, it is contemplated and within the scope of this disclosure that various embodiments of a microcontroller may include external node 928 to allow for connection of an external capacitor 906a as explained hereinabove. An additional adjustable capacitor(s) 906b (and 906c) may be present internally and may be switchably coupled to the analog bus 932a. However, other embodiments may not provide for such an external node 928. Instead, either capacitance 916 may have the appropriate value or an additional internal capacitance 906b, for example a variable capacitance, is or can be connected to bus 932. Furthermore, as each external node 926, 928, and 930 may be programmable to support multiple functions, additional switches (not shown in Figure 9) may be used to allow to use nodes 926, 928, and 930 for other functions as noted above.

Referring to Figures 13 and 14, depicted are schematic voltage-time diagrams of capacitance conversions (Figure 13), and guard ring voltage control (Figure 14) during these conversions, according to specific example embodiments of this disclosure. In segment I the capacitors 906 and 916 (sample and hold capacitor) are charged to Vdd, the capacitive sensor capacitor 904 is discharged to Vss, and the guard ring capacitance 902 is discharged to Vss (substantially matching the voltage on the capacitor 904). In segment II the capacitors 906, 916 and 904 are coupled together and a quiescent voltage of about 1/3 * Vdd will result when the capacitive touch key 108 is not depressed, and a little less than 1/3 * Vdd when depressed. The guard ring capacitance 902 follows the voltage on the capacitor 904 (capacitive sensor) so as to minimize any parasitic capacitances therebetween. Toward the end of segment II the sample and hold capacitor 916 decouples from the capacitors 906 and 904 and retains the quiescent voltage obtained during segment II. In segment III any voltage charge on the capacitor 904 (capacitive sensor) is discharged to substantially Vss, then at the beginning of segment IV the capacitor 904 (capacitive sensor) and the guard ring capacitance 902 are charged to substantially Vdd. Meantime also in segment IV the quiescent voltage stored on the sample and hold capacitor 916 is converted by the ADC 918 to a digital value representing the quiescent voltage and read by the digital processor 106. The digital value from the ADC 918 is used in determining whether the capacitive sensor was being actuated (touched), e.g., quiescent voltage lower then what is expected from a non-actuated touch sensor or not. When the capacitive value of the touch sensor capacitor 904 is actuated (touched) its capacitance increases and the subsequent quiescent voltage will thereby be less then when not actuated. This is true when the capacitor 904 is initialized to Vss, When the capacitor 904 is initialized to Vdd, the subsequent quiescent voltage is about 2/3 * Vdd when the capacitive sensor is not actuated.

In segment V the capacitors 906 and 916 (sample and hold capacitor) are discharged to Vss, the capacitive sensor capacitor 904 and guard ring capacitance 902 have already been charged to Vdd. In segment VI the capacitors 906, 916 and 904 are coupled together and a quiescent voltage of about 2/3 * Vdd will result when the capacitive touch key 108 is not depressed, and a little more than 2/3 * Vdd when depressed. The guard ring capacitance 902 follows the voltage on the capacitor 904 (capacitive sensor) so as to minimize any parasitic capacitances therebetween. Toward the end of segment VI the sample and hold capacitor 916 decouples from the capacitors 906 and 904 and retains the quiescent voltage obtained during segment VI. In segment VII the capacitor 904 (capacitive sensor) is charged to substantially Vdd, then at the beginning of segment VIII the capacitor 904 (capacitive sensor) and the guard ring capacitance 902 are discharged to substantially Vss. Meantime also in segment VIII the quiescent voltage stored on the sample and hold capacitor 916 is converted by the ADC 918 to a digital value representing the quiescent voltage and read by the digital processor 106. The digital value from the ADC 918 is used in determining whether the capacitive sensor was being actuated (touched), e.g., quiescent voltage lower than what is expected from a non-actuated touch sensor or not. When the capacitive value of the touch sensor capacitor 904 is actuated (touched) its capacitance increases and the subsequent quiescent voltage will thereby be greater than when not actuated. This is true when the capacitor 904 is initialized to Vdd. When the capacitor 904 is initialized to Vss, the subsequent quiescent voltage is about 1/3 * Vdd when the capacitive sensor is not actuated, as described hereinabove. These sequences repeat for each one of the touch keys 108. Also by inverting the voltage charge polarities every other capacitive measurement cycle and averaging the capacitive measurement values, a type of differential operation is achieved that minimizes common mode noise and interference, e.g., 60 Hz power line interference. It is contemplated and within the scope of this disclosure that the guard ring 3020 may or may not present. Wherein the ADC controller 1 10 controls timing, switch and driver selections for charging and discharging of the capacitive touch sensor capacitor 904 and the ADC sample and hold capacitor 916 (and 906); coupling the capacitors 904 and 906 together, causing the ADC to sample the resulting charge voltage and convert the sampled charge voltage to a digital value, and notifying the digital processor 106 that the digital value of the sampled charge voltage is available. In addition, the ADC controller 1 10 may control the timing, switch and driver selections for charging and discharging of the guard ring 3020.

Referring to Figure 15, depicted is a schematic timing diagram of the capacitive conversion system shown in Figure 9. Voltages on nodes 924, 926, 928 and 930 are shown in relation to the operational open and close combinations of switches A-F. It is contemplated and within the scope of this disclosure that other and further circuit designs and timing diagrams could be used with equal effect, and one having ordinary skill in electronic circuit design and having the benefit of this disclosure could replicate the results described herein.

Referring to Figure 16, depicted is a schematic timing diagram of the capacitive conversion system shown in Figure 1 1. Voltages on nodes 924, 926, 928 and 930 are shown in relation to the operational open and close combinations of switches A-F. Figure 16 basically represents the same voltage and timing waveforms as shown in Figure 15. It is contemplated and within the scope of this disclosure that other and further circuit designs and timing diagrams could be used with equal effect, and one having ordinary skill in electronic circuit design and having the benefit of this disclosure could replicate the results described herein.

Referring to Figures 17 and 18, depicted are schematic process flow diagrams of capacitive conversions, according to a specific example embodiment of this disclosure. The schematic process flow diagrams depicted in Figures 17 and 18 represent operation of the mixed signal integrated circuit device having CVD processing capabilities shown in Figures 9, 10 and 15. For a first capacitive measurement the following steps may be performed. In step 1 102 a capacitance value conversion is started. In step 1 104 the sample and hold capacitor combination of the capacitors 906 and 916 are charged to a first voltage. In step 1 106 the capacitive sensor is charged to a second voltage. The first voltage may be Vdd and the second voltage may be Vss or visa versa. Optionally, in step 1108 the capacitive sensor guard ring may be charged to the second voltage so as to minimize parasitic capacitance that would otherwise develop at the capacitive sensor due to electrostatic charge caused by a difference of voltage potential between the capacitive sensor and adjacent conductors.

Next in step 1 1 10 the sensor guard ring is charged discharged to a third voltage contemporaneously with execution of step 1 1 12 in which the sample and hold capacitor combination, previously charged to the first voltage, is coupled to the capacitive sensor, previously charged to the second voltage. Steps 1 1 10 and 1 1 12 may be interchanged so long as both occur contemporaneously with each other. In step 1 1 14 the sample and hold capacitor and the capacitive sensor are coupled together long enough in time for a complete settling to a quiescent first charge. Then in step 1 1 16 the sample and hold capacitor is decoupled from the capacitive sensor and the sample and hold capacitor thereafter retains the settled first charge. In step 1 1 18 conversion to a digital representation of the first charge stored in the sample and hold capacitor begins.

In step 1 120 the capacitive sensor is briefly discharged to the second voltage. In step 1 122 the capacitive sensor is charged to the first voltage. Optionally, in step 1 124 the capacitive sensor guard ring is charged to the first voltage so as to minimize parasitic capacitance that would otherwise develop at the capacitive sensor due to electrostatic charge caused by a difference of voltage potential between the capacitive sensor and adjacent conductors. In step 1 126 the conversion of the first charge to a digital representation thereof terminates and is then read by the digital processor 106 for determining the capacitance value of the capacitive sensor 108.

For an optional second capacitive measurement the following steps may be performed. In step 1 128 the sample and hold capacitor combination of the capacitors 906 and 916 are charged to the second voltage. In step 1 130 the capacitive sensor is charged to the first voltage. Optionally, in step 1 132 the capacitive sensor guard ring is charged to the first voltage so as to minimize parasitic capacitance that would otherwise develop at the capacitive sensor due to electrostatic charge caused by a difference of voltage potential between the capacitive sensor and adjacent conductors.

Optionally, next in step 1 134 the sensor guard ring is charged/discharged to a fourth voltage contemporaneously with execution of step 1 136 in which the sample and hold capacitor combination, previously charged to the second voltage level, is coupled to the capacitive sensor, previously charged to the first voltage. Steps 1 134 and 1 136 may be interchanged so long as both occur contemporaneously with each other. In step 1 138 the sample and hold capacitor combination and the capacitive sensor are coupled together long enough in time for a complete settling to a quiescent second charge. Then in step 1 140 the sample and hold capacitor is decoupled from the capacitive sensor and the sample and hold capacitor thereafter retains the settled second charge). In step 1 142 a conversion to a digital representation of the second charge stored in the sample and hold capacitor begins.

In step 1 144 the capacitive sensor is briefly discharged to the first voltage. In step 1 146 the capacitive sensor is charged to the second voltage. Optionally, in step 1 148 the capacitive sensor guard ring is charged to the second voltage so as to minimize parasitic capacitance that would otherwise develop at the capacitive sensor due to electrostatic charge caused by a difference of voltage potential between the capacitive sensor and adjacent conductors. In step 1 150 the conversion of the second charge to a digital representation thereof terminates and is then read by the digital processor 106 for determining the capacitance value of the capacitive sensor 108. An advantage of obtaining both first and second charge conversions is that they may be processed to reduce common mode noise and interference, e.g., 60 Hz power line interference.

Referring to Figures 19 and 20, depicted are schematic process flow diagrams of capacitive conversions, according to another specific example embodiment of this disclosure. The schematic process flow diagrams depicted in Figures 19 and 18 represent operation of the mixed signal integrated circuit device having CVD processing capabilities shown in Figures 1 1 , 12 and 16. For a first capacitive measurement the following steps may be performed. In step 1202 a capacitance value conversion is started. In step 1204 the sample and hold capacitor combination of the capacitors 906 and 916 are charged to a first voltage. In step 1206 the capacitive sensor and, optionally, the capacitive sensor guard ring are charged to a second voltage. The first voltage may be Vdd and the second voltage may be Vss or visa versa. Optionally, the capacitive sensor guard ring may be charged to the second voltage so as to minimize parasitic capacitance that would otherwise develop at the capacitive sensor due to electrostatic charge caused by a difference of voltage potential between the capacitive sensor and adjacent conductors.

In step 1212 the sample and hold capacitor combination, previously charged to the first voltage, is coupled to the capacitive sensor, previously charged to the second voltage. In step 1214 the sample and hold capacitor and the capacitive sensor are coupled together long enough in time for a complete settling to a common quiescent first charge. Then in step 1216 the sample and hold capacitor is decoupled from the capacitive sensor and the sample and hold capacitor thereafter retains the settled first charge. In step 1218 conversion to a digital representation of the first charge stored in the sample and hold capacitor begins.

In step 1220 the capacitive sensor and, optionally, the guard ring are briefly discharged to the second voltage. In step 1222 the capacitive sensor and, optionally, the guard ring are charged to the first voltage. Optionally, the capacitive sensor guard ring may be charged to the first voltage so as to minimize parasitic capacitance that would otherwise develop at the capacitive sensor due to electrostatic charge caused by a difference of voltage potential between the capacitive sensor and adjacent conductors. In step 1226 the conversion of the first charge to a digital representation thereof terminates and is then read by the digital processor 106 for determining the capacitance value of the capacitive sensor 108.

For an optional second capacitive measurement the following steps may be performed. In step 1228 the sample and hold capacitor combination of the capacitors 906 and 16 are charged to the second voltage. In step 1230 the capacitive sensor and, optionally, the capacitive sensor guard ring are charged to the first voltage. Optionally, the capacitive sensor guard ring may be charged to the first voltage so as to minimize parasitic capacitance that would otherwise develop at the capacitive sensor due to electrostatic charge caused by a difference of voltage potential between the capacitive sensor and adjacent conductors.

In step 1236 the sample and hold capacitor combination, previously charged to the second voltage level, is coupled to the capacitive sensor, previously charged to the first voltage. In step 1238 the sample and hold capacitor combination and the capacitive sensor are coupled together long enough in time for a complete settling to a quiescent second charge. Then in step 1240 the sample and hold capacitor is decoupled from the capacitive sensor and the sample and hold capacitor thereafter retains the settled second charge). In step 1242 a conversion to a digital representation of the second charge stored in the sample and hold capacitor begins.

In step 1244 the capacitive sensor and, optionally, the guard ring are briefly discharged to the first voltage. In step 1246 the capacitive sensor and, optionally, the guard ring are charged to the second voltage. Optionally, the capacitive sensor guard ring may be charged to the second voltage so as to minimize parasitic capacitance that would otherwise develop at the capacitive sensor due to electrostatic charge caused by a difference of voltage potential between the capacitive sensor and adjacent conductors. In step 1250 the conversion of the second charge to a digital representation tliereof terminates and is then read by the digital processor 106 for determining the capacitance value of the capacitive sensor 108. An advantage of obtaining both first and second charge conversions is that they may be processed to reduce common mode noise and interference, e.g., 60 Hz power line interference.