MICROCRYSTALLINE-TO-AMORPHOUS GOLD ALLOY AND PLATED FILM, AND PLATING SOLUTION FOR THOSE, AND PLATED FILM FORMATION METHOD

WIPO Patent Application WO/2010/095658

A1

Disclosed is a microcrystalline-to-amorphous gold alloy-plated film having excellent electrical properties and excellent mechanical properties. Physical properties including both the advantageous properties of a crystalline structure and the advantageous properties of an amorphous structure can be obtained by allowing a microcrystalline phase and an amorphous phase to exist in a mixed state at a specific ratio. The average particle diameter of the microcrystals is 30 nm or smaller, the volume fraction of the microcrystals is 10 to 90%, the knoop hardness is Hk 180 or more, the specific resistivity is 200 μΩ·cm or less. In the film, hardness and abrasion resistance can be improved while maintaining a good specific resistivity value and chemical stability both inherent to gold at practically insignificant levels. Therefore, the film is useful as a material for connecting an electric or electronic component such as a connector and a relay.

OSAKA TETSUYA (JP)
OKINAKA YUTAKA (JP)
SENDA KAZUTAKA (JP)
IWAI RYOTA (JP)
KATO MASARU (JP)

PCT/JP2010/052364

August 26, 2010

February 17, 2010

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UNIV WASEDA (JP)
KANTO KAGAKU (JP)
OSAKA TETSUYA (JP)
OKINAKA YUTAKA (JP)
SENDA KAZUTAKA (JP)
IWAI RYOTA (JP)
KATO MASARU (JP)

C25D3/62; C25D7/00

JP2000026989A	2000-01-25
JP2007169706A	2007-07-05

KUZUWA, Kiyoshi et al. (JP)
Seiji Kuzuwa (JP)

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